公开(公告)号：JPH10134492A

公开(公告)日：1998-05-22

申请号：JP14499397

申请日：1997-06-03

Applicant: IBM

Inventor： KASIRAJ PRAKASH ,  MEEKS STEVEN WAYNE ,  REILEY TIMOTHY CLARK

IPC: G11B19/00 ,  G11B5/55 ,  G11B21/21 ,  G11B19/04

Abstract: PROBLEM TO BE SOLVED: To provide the magnetic recording disk drive equipped with a magneto-resistance(MR) read head for detecting external impact by utilizing a thermal resistance effect in an MR head signal and suppressing write-in operation. SOLUTION: The magnetic recording disk drive equipped with the MR read head 60 is equipped with an impact detecting circuit 55 for responding to a thermal resistance signal contained in the signal from the head. The MR head 60 is heated by a bias current, and is supported on a head carrier close to the surface of the disk 10. A space between the carrier 13 and the disk is changed by external impact upon the disk drive, and hence the heated head is cooled by, the disk, so that a head temp. is varied. Such a variation in the temp. is reflected as the thermal resistance signal including modulation of a base line voltage level to the signal from the head. Positive and negative deviation of this thermal resistance signal is compared with a prescribed threshold voltage level by the impact detecting circuit 55.

公开(公告)号：DE69722857D1

公开(公告)日：2003-07-24

申请号：DE69722857

申请日：1997-04-02

Applicant: IBM

Inventor： KASIRAJ PRAKASH ,  MEEKS STEVEN WAYNE ,  REILEY TIMOTHY CLARK

IPC: G11B19/00 ,  G11B5/55 ,  G11B21/21 ,  G11B19/02 ,  G11B33/08

Abstract: A magnetic recording disk drive with a magnetoresistive (MR) read sensor or head has a shock and vibration detection circuitry responsive to a thermoresistive signal contained in the signal from the head. The MR head is heated by an electrical bias current and is supported on the head carrier near the surface of the disk. External shock or vibration to the disk drive alters the spacing between the carrier and the disk, which causes fluctuations in the head temperature due to cooling of the heated head by the disk. These temperature fluctuations are reflected in the signal from the head as a thermoresistive signal comprising modulation of a baseline voltage level. The shock detection circuitry compares positive and negative excursions of this thermoresistive signal with a predetermined threshold voltage level. When the threshold is exceeded, indicating an external shock or vibration in excess of an allowable limit, writing of data is inhibited.

公开(公告)号：DE3787772D1

公开(公告)日：1993-11-18

申请号：DE3787772

申请日：1987-07-24

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  KANG SUNG KWON ,  MOSKOWITZ PAUL ANDREW ,  RYAN JAMES GARDNER ,  REILEY TIMOTHY CLARK ,  WALTON ERICK GREGORY ,  BICKFORD HARRY RANDALL ,  PALMER MICHAEL JOHN

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/48

公开(公告)号：DE69003333T2

公开(公告)日：1994-04-21

申请号：DE69003333

申请日：1990-07-07

Applicant: IBM

Inventor： KANG SUNG KWON ,  PALMER MICHEAL JON ,  REILEY TIMOTHY CLARK ,  TOPA ROBERT DAVID

IPC: B23K20/02 ,  B23K20/233 ,  B23K33/00 ,  H01L21/60 ,  H01L21/603 ,  H01L21/00

Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

公开(公告)号：DE69003333D1

公开(公告)日：1993-10-21

申请号：DE69003333

申请日：1990-07-07

Applicant: IBM

Inventor： KANG SUNG KWON ,  PALMER MICHEAL JON ,  REILEY TIMOTHY CLARK ,  TOPA ROBERT DAVID

IPC: B23K20/02 ,  B23K20/233 ,  B23K33/00 ,  H01L21/60 ,  H01L21/603 ,  H01L21/00

Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

公开(公告)号：DE3676832D1

公开(公告)日：1991-02-21

申请号：DE3676832

申请日：1986-02-07

Applicant: IBM

Inventor： BLAKESLEE MARYBELLE C ,  CHANCE DUDLEY AUGUSTUS ,  EASTMAN DEAN ERIC ,  GNIEWEK JOHN J ,  HO CHUNG WEN ,  LEVINE ERNEST N ,  ORDONEZ JOSE E ,  REILEY TIMOTHY CLARK ,  SKARVINKO EUGENE R

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40

公开(公告)号：DE68920944D1

公开(公告)日：1995-03-16

申请号：DE68920944

申请日：1989-08-24

Applicant: IBM

Inventor： BICKFORD HARRY RANDALL ,  BREGMAN MARK FIELDING ,  CIPOLLA THOMAS MARIO ,  GOW JOHN ,  LEDERMANN PETER GERARD ,  MIERSCH EKKEHARD FRITZ ,  OLSON LEONARD THEODORE ,  PAGNINI DAVID PETER ,  REILEY TIMOTHY CLARK ,  TSOU UH-PO ERIC ,  VILKELIS WALTER VALERIAN

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H01L23/64

公开(公告)号：AU590413B2

公开(公告)日：1989-11-02

申请号：AU7214387

申请日：1987-04-28

Applicant: IBM

Inventor： HODGSON RODNEY TREVOR ,  JONES HARRY JORDAN ,  LEDERMANN PETER GERARD ,  REILEY TIMOTHY CLARK ,  MOSKOWITZ PAUL ANDREW

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40 ,  H01L23/50 ,  H05K1/11

公开(公告)号：DE69011233T2

公开(公告)日：1995-03-09

申请号：DE69011233

申请日：1990-05-22

Applicant: IBM

Inventor： BICKFORD HARRY RANDALL ,  BOLAND WILLIAM LEO ,  MORRIS DANIEL PETER ,  REILEY TIMOTHY CLARK

IPC: G01R31/26 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L23/498 ,  H01L23/544

Abstract: A TAB package comprises an elongated tape (10) which has a plurality of sets of beam leads emplaced thereon and a plurality of electronic devices (28) connected to the beam leads. At least a first beam (32) lead of each set is connected to a common potential terminal (16) on each device, and at least a second beam lead (30) of each set is connected to a power terminal (18). A common potential bus is oriented along the elongated dimension of the tape and connects to the first beam leads, while a power bus is also oriented along the elongated dimension of the tape and is connected to the second beam leads. The application of power to the power bus and the simultaneous grounding of the common potential bus enables all electronic devices on the tape to be simultaneously energized and to be then subjected to an elevated temperature environment for static burn-in testing. To improve current conduction in the power and common potential buses, a tape comprising a non-conductive carrier (42) and a pair of interposer/conductor tapes (41) may be emplaced over the length of the tape bearing the chips. An additional spacer tape (50) is then emplaced over the interposer tape and forces the interposer conductors into contact with the power and common potential buses.

公开(公告)号：DE3788455D1

公开(公告)日：1994-01-27

申请号：DE3788455

申请日：1987-04-10

Applicant: IBM

Inventor： HODGSON RODNEY TREVOR ,  JONES HARRY JORDAN ,  LEDERMANN PETER GERARD ,  REILEY TIMOTHY CLARK ,  MOSKOWITZ PAUL ANDREW

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/538 ,  H05K3/40 ,  H01L23/498 ,  H01L23/52