公开(公告)号：JP2003266396A

公开(公告)日：2003-09-24

申请号：JP2003006130

申请日：2003-01-14

Applicant: IBM

Inventor： COHEN GUY MOSHE ,  CORDES STEVEN ALAN ,  ROSNER JOANNA ,  TREWHELLA JEANNINE MADELYN

IPC: B81B1/00 ,  B81C1/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing micro-structures, such as micro-electromechanical structures (MEMS) or silicon optical benches. SOLUTION: The method includes using a single mask to pattern a plurality of cavity areas to be etched on a substrate in different etching steps, and then selectively choosing the cavity areas for etching. In a preferred embodiment, the method includes patterning a substrate to identify a plurality of cavity areas to be etched on the substrate and filling at least one of the cavity areas with a distinctive filler material. The filler material is chemically distinctive in the sense that it can be etched selectively with respect to the other filling materials 203, 205, 206, 207. The methods of the invention produce micro- structures with more accurate cavity areas by minimizing overlay error and avoiding the need for lithography over extreme topography. COPYRIGHT: (C)2003,JPO