公开(公告)号：EP3028294A4

公开(公告)日：2016-10-19

申请号：EP14832804

申请日：2014-07-29

Applicant: IBM

Inventor： DANG BING ,  KNICKERBOCKER JOHN U ,  TSANG CORNELIA KANG-I

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67132 ,  B23K26/36 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation

Abstract translation: 提供的结构和方法用于使用包括一个或多个可使用中波长红外辐射激光可消除的可释放层的结合结构将处理器晶片临时粘合到器件晶片

公开(公告)号：JP2008042904A

公开(公告)日：2008-02-21

申请号：JP2007195973

申请日：2007-07-27

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： NILS DENEKE HOIVIK ,  JOHN MICHAEL COTT ,  KNICKERBOCKER JOHN U ,  GAUCHER BRIAN P ,  JANUSZ GRZYB ,  CHRISTOPHER VINCENT JAHNES ,  JOHN HAROLD MAGERLEIN ,  CHIRAG SURYAKANT PATEL ,  DUIXIAN LIU ,  PFEIFFER ULLRICH R ,  TSANG CORNELIA KANG-I

IPC: H01Q19/06 ,  H01L23/12 ,  H01L23/14 ,  H01L25/00 ,  H01Q19/10 ,  H01Q19/12

CPC classification number: H01L25/165 ,  H01L23/66 ,  H01L24/24 ,  H01L24/82 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01L2924/00 ,  H01L2224/0401

Abstract: PROBLEM TO BE SOLVED: To provide a Si-based packaging with integrated passive components for millimeter wave applications. SOLUTION: An apparatus is described incorporating an interposer 1 having a cavity for a portion of an antenna structure 22, having conductor through vias 3, a top Si part 6 having interconnection wiring 72, 73, 74 and having pads for electrically mounting an integrated circuit chip 21 thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and the top Si part may be scaled to provide an array of functional units. This invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供用于毫米波应用的集成无源组件的Si基封装。 解决方案：描述一种装置，其包括具有用于天线结构22的一部分的腔的插入器1，其具有导体穿过通孔3，顶部Si部分6具有互连布线72,73,74并具有用于电安装的垫 其上的集成电路芯片21，其中顶部Si部件电气和机械地与插入器配合。 插入器和顶部Si部分可以被缩放以提供功能单元的阵列。 本发明克服了将高效率天线与Si封装中的集成电路芯片组合在一起的信号频率为1至100GHz的问题，以及屏蔽靠近天线的组件的问题，并减少了由于TCE失配引起的应变。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：SG11201600462VA

公开(公告)日：2016-02-26

申请号：SG11201600462V

申请日：2014-07-29

Applicant: IBM

Inventor： DANG BING ,  KNICKERBOCKER JOHN U ,  TSANG CORNELIA KANG-I

IPC: H01L21/02 ,  H01L21/683

Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation