公开(公告)号：CA2062153A1

公开(公告)日：1992-09-12

申请号：CA2062153

申请日：1992-03-02

Applicant: IBM

Inventor： BONA GIAN-LUCA ,  HEUBERGER WILHELM ,  ROENTGEN PETER ,  UNGER PETER

IPC: H01S5/00 ,  H01L21/20 ,  H01L29/737 ,  H01L33/00 ,  H01L33/16 ,  H01L33/24 ,  H01L33/30 ,  H01S5/16 ,  H01S5/223 ,  H01S5/32 ,  H01S5/323 ,  H01S3/025 ,  H01S3/08 ,  H01L21/203

Abstract: SZ 9-91-002 Semiconductor device (30) such as a laser diode grown on a structured substrate surface having horizontal regions with adjacent inclined sidewall surfaces: the horizontal regions (32o) of standard orientation like (100) or slightly off, the inclined surfaces (32m) misoriented. The layers (33 to 36) forming the device are grown over the structured surface, at least the active layer (34) being of a semiconductor material that assumes ordered or disordered states depending on the orientation or misorientation of the substrate surface. The center section (34a) of the active layer is deposited over a horizontal substrate region (32o), this section thus being in the ordered state and having a lower bandgap energy than terminating sections (34b) grown on inclined substrate regions (32m), therefore having a wider bandgap. The active layer can be terminated in either lateral direction with wider bandgap material whereby devices of a buried structure, with strong carrier confinement, and/or with non-absorbing mirrors, allowing high optical power operation, can be realized.

公开(公告)号：CA2065980A1

公开(公告)日：1992-11-04

申请号：CA2065980

申请日：1992-04-14

Applicant: IBM

Inventor： BUCHMANN PETER L ,  UNGER PETER ,  VETTIGER PETER ,  VOEGELI OTTO

IPC: G12B15/06 ,  H01L23/34 ,  H01L23/433 ,  H01L31/024 ,  H01L33/48 ,  H01L33/64 ,  H01S5/024 ,  H01L23/42 ,  H01L21/50 ,  H01L21/60

Abstract: SZ9-90-016 COOLING STRUCTURES AND PACKAGE MODULES FOR SEMICONDUCTORS Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink. The inventive cooling structure consists of a current/voltage supply level with metal structures and insulation spacers and/or layers, partly covered by an insulation layer and followed by a heat transfer structure. A heat transfer bridge in thermal connection to the heat transfer structure provides for heat flux between the inventive cooling structure and the heat sink.