公开(公告)号：DE3779253D1

公开(公告)日：1992-06-25

申请号：DE3779253

申请日：1987-08-18

Applicant: IBM

Inventor： AMENDOLA ALBERT ,  KUMAR ANANDA HOSAKERE ,  VANCE THOMAS RAY

IPC: H01L21/3205 ,  H05K3/04 ,  H05K3/20 ,  H05K3/22 ,  H05K3/32 ,  H05K3/40 ,  H01L23/52 ,  H01L21/48 ,  H01L21/90 ,  H03K3/22

Abstract: Disclosed is a method for repairing opens (12) in thin film conductor lines (11) on a substrate (10), preferably a multilayered ceramic substrate. An unpatterned repair metal film (20) is placed over a general area of open defects (12) in conductive lines (11) on a substrate (10). Preferably, this metal is placed over the conductive lines and opens therein by decal transfer. The assembly is then heated to cause diffusion bonding between the repair metal (20) and conductive lines (11), but not between the repair metal (20) and substrate (10). After diffusion bonding, the structure has metal bridges formed across any open defects covered by the repair film and also between adjacent conductive lines. The area of repair is then subjected to ultrasonic energy in a liquid ambient for a time at least long enough to remove metal bridges between adjacent conductive lines, but less than that required to remove repair metal bridges over the opens in the conductive lines. The resultant structure has metal bridges spanning opens in the conductive lines, and no metal bridges between adjacent conductive lines.