公开(公告)号：DE68911456T2

公开(公告)日：1994-06-23

申请号：DE68911456

申请日：1989-08-09

Applicant: IBM

Inventor： LEACH MICHAEL ALBERT ,  MACHESNEY BRIAN JOHN ,  PAULSEN JAMES KONRAD ,  VENDITTI DANIEL JOHN ,  WHITAKER CHRISTOPHER ROBERT

IPC: B24B7/16 ,  B24B7/22 ,  B24B37/08 ,  B24B37/04 ,  H01L21/00

Abstract: A polishing tool for abrasively polishing a semiconductor wafer that edge clamps the wafer (100) between two rollers (102, 104). The wafer is spun-up in one plane and the rollers spin in a second plane which is orthogonal to the wafer spin plane. One of the rollers is split with each section rotating in opposite directions. Each of the rollers is mounted by a spring-gimballed assembly (202, 204) to follow the wafer contour.

公开(公告)号：DE68911456D1

公开(公告)日：1994-01-27

申请号：DE68911456

申请日：1989-08-09

Applicant: IBM

Inventor： LEACH MICHAEL ALBERT ,  MACHESNEY BRIAN JOHN ,  PAULSEN JAMES KONRAD ,  VENDITTI DANIEL JOHN ,  WHITAKER CHRISTOPHER ROBERT

IPC: B24B7/16 ,  B24B7/22 ,  B24B37/08 ,  B24B37/04 ,  H01L21/00

Abstract: A polishing tool for abrasively polishing a semiconductor wafer that edge clamps the wafer (100) between two rollers (102, 104). The wafer is spun-up in one plane and the rollers spin in a second plane which is orthogonal to the wafer spin plane. One of the rollers is split with each section rotating in opposite directions. Each of the rollers is mounted by a spring-gimballed assembly (202, 204) to follow the wafer contour.