公开(公告)号：US3461338A

公开(公告)日：1969-08-12

申请号：US3461338D

申请日：1967-01-16

Applicant: IBM

Inventor： VOGEL SIEGFRIED FRIEDRICH

IPC: H01J1/15 ,  H01J3/02 ,  H01J1/02

CPC classification number: H01J1/15 ,  H01J3/026

公开(公告)号：DE2809359A1

公开(公告)日：1978-09-28

申请号：DE2809359

申请日：1978-03-04

Applicant: IBM

Inventor： VOGEL MARCEL JOSEPH ,  VOGEL SIEGFRIED FRIEDRICH

IPC: G11C11/14 ,  G01B3/02 ,  G01B11/30 ,  G01N27/04 ,  G01N27/20 ,  G03F7/20 ,  H01F10/00 ,  H01L23/544 ,  H01L21/66 ,  G11C19/08 ,  H01L29/76

Abstract: A wafer indexing and mapping system is useful for precisely locating artifacts, defects, and fabricated structural components on a wafer. A permanent micrometer grid pattern is applied to the backside of the wafer, for example, a transparent bubble wafer. The grid pattern forms an array of uniform size cells, for example, 40 unit cells wide by 40 unit cells long. Each unit cell is divided into smaller units on each side. Each cell contains a coding or indexing system to identify the row and column of the cell in the grid pattern. The grid pattern contains orientation bars which identify orientation with respect to particular wafer reference lines. The simultaneous viewing of the wafer and the grid pattern permits an accurate permanent mapping of the artifacts, defects, and fabricated structural components on the wafer, as well as on the individual small chips formed by dicing the wafer.

公开(公告)号：DE3573344D1

公开(公告)日：1989-11-02

申请号：DE3573344

申请日：1985-05-07

Applicant: IBM

Inventor： YEACK-SCRANTON CELIA ELIZABETH ,  VOGEL SIEGFRIED FRIEDRICH

IPC: G01R33/12 ,  G01B7/34 ,  G11B5/48 ,  G11B5/60 ,  G11B5/82 ,  G11B5/84 ,  G11B17/028 ,  G11B17/32 ,  G11B21/21 ,  G11B23/00 ,  G11B33/08 ,  G11B33/10 ,  G11B5/58