公开(公告)号：JP2002341304A

公开(公告)日：2002-11-27

申请号：JP2001145687

申请日：2001-05-15

Applicant: IBM

Inventor： WADA TAKEHIKO ,  KOBAYASHI SHIGETAKA ,  YAMADA SHICHIRO ,  HASHIMOTO YUJI

IPC: G02F1/13 ,  G02F1/1335 ,  G02F1/1337

Abstract: PROBLEM TO BE SOLVED: To efficiently and certainly modify a bright spot defective part of an optical device such as a liquid crystal display device. SOLUTION: The bright spot defective part formed on the liquid crystal display device 10 is irradiated with laser light emitted from a laser light source 101 via an attenuator 102, a half-wave plate 103, a beam expander 104, a variable slit 105 and a filter 60 from the display surface 10s side of the liquid crystal display device 10. In this case, because a wavelength of the laser light to be emitted is selected at a wavelength controlling part 106 corresponding to a color of a color filter on the bright spot defective part, the laser light passes through the color filter, reaches an alignment layer and changes the nature of the alignment layer.

公开(公告)号：JP2003140164A

公开(公告)日：2003-05-14

申请号：JP2001327472

申请日：2001-10-25

Applicant: IBM

Inventor： WADA TAKEHIKO ,  KOBAYASHI SHIGETAKA ,  KAYAMA TAKUSHI ,  MORITA HIDEYUKI

IPC: G02F1/1343 ,  G02F1/13 ,  G02F1/1333 ,  G02F1/1345 ,  G09F9/00 ,  G09F9/30

Abstract: PROBLEM TO BE SOLVED: To provide a method of repairing extraction wiring sections of a liquid crystal display device. SOLUTION: Repairing is performed by irradiating the connection pads of the extraction wiring sections of the liquid crystal display device with a laser beam of prescribed energy. The connection pads have an ITO surface layer, Mo/Al/Mo under layer, and an undesirable MoO3 insulating layer formed between an ITO layer and an Mo layer. The insulating layer is formed in forming the polymer layer of the PFA liquid crystal display device. The MoO3 insulating layer is heated by irradiating the same with a laser beam having the prescribed energy to the extent of maintaining the uniformity of the ITO surface layer. The thermal energy cuts the bonds of the oxygen of the MoO3 layer and the insulating layer is made conductive. The resistance value of the connection pads is lowered, the uniformity of the ITO surface layer is maintained and the packaging of a driver IC is made possible.

公开(公告)号：JP2003107452A

公开(公告)日：2003-04-09

申请号：JP2001282383

申请日：2001-09-17

Applicant: IBM

Inventor： WADA TAKEHIKO ,  KUNIEDA HIDEAKI ,  KUNIMOTO FUMIYUKI ,  ONO KAZUNARI

IPC: G02B7/00 ,  G02B5/30 ,  G02F1/13 ,  G02F1/1335

Abstract: PROBLEM TO BE SOLVED: To provide a polarization plate adjustment method capable of obtaining a high optical transmissivity by matching the direction of the orientation of a plate with the direction of the transmitting axis of the polarization plate. SOLUTION: The manufacturing method includes a substrate position adjustment process where the direction of a liquid crystal substrate 103 is adjusted to a TFT side master polarization plate 105 whose transmitting axis Tc is known, a polarization plate position adjustment process where the direction of a color filter polarization plate 107 is adjusted to the TFT side master polarization plate 105 whose transmitting axis Tc is known, and a process where the liquid crystal substrate 103 and the color filter polarization plate 107 are adhered by almost matching the direction of an orientation axis Tb of the liquid crystal substrate 103 with the direction of the transparent axis of the color filter polarization plate 107.

公开(公告)号：JP2001023982A

公开(公告)日：2001-01-26

申请号：JP18524199

申请日：1999-06-30

Applicant: IBM

Inventor： IMAHARA KAZUMITSU ,  WADA TAKEHIKO

IPC: H01L21/3205 ,  G02F1/13 ,  G02F1/1343 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  G09F9/00 ,  H01L21/336 ,  H01L21/768 ,  H01L23/52 ,  H01L23/522 ,  H01L29/786

Abstract: PROBLEM TO BE SOLVED: To obtain a restoring method for recovering functions of electronic components including semiconductor devices, such as liquid crystal displays, when defects occurs in such electronic parts, by restoring their defective portions. SOLUTION: In an electronic component 18, where a plurality of thin films 26 and 28 are laminated on a substrate 24 and properly formed into a prescribed pattern, a transfer film for restoring defects is fitted into a recess 34, to which a lower-layer thin film is exposed by removing part of one or a plurality of layers of the films 26 and 28 including a defective portion 30. Furthermore, a method of restoring defects of the electronic component comprises the steps of removing the portions of the films 26 and 28 covering the peripheral portion of the portion 30 including the portion 30 into a recessed portion 34 to expose the lower-layer thin film, and fitting the transfer film for restoring the defect into the portion 34 to cover the exposed film 26.