公开(公告)号：US3854071A

公开(公告)日：1974-12-10

申请号：US31524672

申请日：1972-12-14

Applicant: IBM

Inventor： HERITAGE M ,  WARDLY G

IPC: H01J37/04 ,  H01J37/147 ,  H01J37/304 ,  H01J37/305 ,  H01L21/027 ,  H01J29/52

CPC classification number: H01J37/304 ,  H01J37/1475

Abstract: The present invention relates to circuit means for use in combination with an electron beam projection system of the type wherein an image is projected onto a wafer by means of a scanning electron beam. The circuit means is employed to provide a regulated scan rate. In the system either the secondary electron current from the wafer or the wafer current itself is used to drive a pre-amplifier, the output of which is sent to a pair of attenuator networks to provide scan control. The outputs of the attenuators are fed to a pair of integrating amplifiers, the outputs of which are used to drive a pair of deflection amplifiers after passing through a pair of scan limit detectors and flyback circuits. The outputs of the deflection amplifiers are used to drive the X and Y deflection coils located before the final condenser lens.

Abstract translation: 本发明涉及与电子束投影系统结合使用的电路装置，其中通过扫描电子束将图像投射到晶片上。 电路装置用于提供调节的扫描速率。 在系统中，来自晶片的二次电子电流或晶片电流本身用于驱动前置放大器，其输出被发送到一对衰减器网络以提供扫描控制。 衰减器的输出被馈送到一对积分放大器，其输出用于在通过一对扫描限制检测器和反激电路之后驱动一对偏转放大器。 偏转放大器的输出用于驱动位于最终聚光透镜之前的X和Y偏转线圈。

公开(公告)号：CA936956A

公开(公告)日：1973-11-13

申请号：CA113586

申请日：1971-05-21

Applicant: IBM

Inventor： ROMANKIW L ,  WARDLY G

IPC: G11B5/17 ,  G11B5/31

Abstract: A rectangular thin film transducer head includes a magnetic core composed of overlapping laminations of permalloy film joined together magnetically and electrically, near an air gap, at one end of the rectangle, between the two laminations, which gap couples flux to the magnetic recording medium. Two electrically parallel insulated thin film copper windings starting at the end opposite the gap are deposited about the core joining electrically at the end adjacent to the gap to a conductor coupled to both permalloy laminations which conduct return current through the legs of the core inside of the windings. Alternatively, a single series winding passes around the core and through the gap. The head is manufactured by means of photolithographic, vacuum, and thin film techniques.