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公开(公告)号：DE69120903D1
公开(公告)日：1996-08-22
申请号：DE69120903
申请日：1991-11-20
Applicant: IBM
Abstract: An integrated circuit device (16) is selected and positioned adjacent a first side of a circuit board (18) at a desired mounting point utilising a robotic manipulator (12) and a placement head (14). A support fixture (22) is then urged into temporary contact with a second side of the circuit board utilising a flexible mounting system such that minor variations or misalignments between the plane of the support fixture, the circuit board and the placement head are reduced. In one embodiment of the present invention a flexible fluid filled bag (74) is utilised in conjunction with the support fixture so that the presence of components (20) on the second side of the circuit board may be accommodated while supporting the circuit board during component mounting. Finally, the requirement for providing a robotic manipulator and placement head capable of generating the substantial downward forces necessary to create a bond between a circuit board and an electronic component by movement thereof is avoided by positioning the placement head and heated bonding tool (20) proximate to the conductive leads of an electronic component and then forcefully urging the support fixture upward toward the heated bonding tool while maintaining the heated bonding tool in a fixed position.
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公开(公告)号：DE69114676T2
公开(公告)日：1996-06-20
申请号：DE69114676
申请日：1991-11-20
Applicant: IBM
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公开(公告)号：CA2134019C
公开(公告)日：1999-03-30
申请号：CA2134019
申请日：1994-10-21
Applicant: IBM
Inventor： ACOCELLA JOHN , BANKS DONALD RAY , BENENATI JOSEPH ANGELO , CAULFIELD THOMAS , HOEBENER KARL GRANT , WATSON DAVID PAUL , CORBIN JOHN S JR
IPC: B23K1/00 , H01L21/48 , H01L23/488 , H01L23/498 , H05K1/11 , H05K3/34 , H05K3/36 , H05K3/42 , H05K1/18
Abstract: High melting temperature Pb/Sn 95/5 solder balls ale connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn so lder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic so lder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The str ucture is reflowed to simultaneously melt the solder on both sides of the halls to allow e ach ball to center between the carrier pad and circuit board pad to form a more symmetric joint. Th is process results in structure that are more reliable under high temperature cycling. Also to further improve reliability the balls are made as large as the I/O spacing allows withou t bridging beam on balls; the two pads are about the same size with more solder on the smaller p ad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larg er substrate sizes columns are used instead of balls.
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公开(公告)号：DE69114676D1
公开(公告)日：1995-12-21
申请号：DE69114676
申请日：1991-11-20
Applicant: IBM
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