公开(公告)号：DE3472333D1

公开(公告)日：1988-07-28

申请号：DE3472333

申请日：1984-08-08

Applicant: IBM

Inventor： ECONOMY JAMES ,  SUSKO JOHN RICHARD ,  VOLKSEN WILLI ,  WHEATER ROBIN ANNE

IPC: C08G63/00 ,  C08G63/60 ,  C09J167/00 ,  C09K3/10 ,  H01B3/42 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

Abstract: Integrated circuit module wherein the cap is sealed to the substrate with a liquid crystalline polyester melt containing about 25 to about 100 mole percent of recurring Units I and about 75 to 0 mole percent of recurring Units II whereinandwherein each R and R, is arylene or cycloalkylene or alkylene or alkylidene.