公开(公告)号：WO2007014882A2

公开(公告)日：2007-02-08

申请号：PCT/EP2006064640

申请日：2006-07-25

Applicant: IBM ,  IBM UK ,  HEDRICK JAMES LUPTON ,  MAGBITANG TEDDIE PEREGRINO ,  SANKARAPANDIAN MUTHUMANICKAM ,  VOLKSEN WILLI ,  KIM HO-CHEOL ,  LEE VICTOR YEE-WAY ,  MILLER ROBERT DENNIS ,  SUNDBERG LINDA KARIN ,  DUBOIS GERAUD JEAN-MICHEL

Inventor： HEDRICK JAMES LUPTON ,  MAGBITANG TEDDIE PEREGRINO ,  SANKARAPANDIAN MUTHUMANICKAM ,  VOLKSEN WILLI ,  KIM HO-CHEOL ,  LEE VICTOR YEE-WAY ,  MILLER ROBERT DENNIS ,  SUNDBERG LINDA KARIN ,  DUBOIS GERAUD JEAN-MICHEL

CPC classification number: C08L101/12 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/31695 ,  H01L21/76807 ,  H01L21/7682 ,  H01L2221/1047

Abstract: A composition of matter and a structure fabricated using the composition. The composition comprising; a resin; polymeric nano-particles dispersed in the resin, each of the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscible with the resin; and a solvent, the solvent volatile at a first temperature, the resin cross-linkable at a second temperature, the polymeric nano-particle decomposable at a third temperature, the third temperature higher than the second temperature, the second temperature higher than the first temperature, wherein a thickness of a layer of the composition shrinks by less than about 3.5% between heating the layer from the second temperature to the third temperature.

Abstract translation: 使用该组合物制造的物质组成和结构。 该组合物包含： 树脂; 分散在树脂中的聚合物纳米颗粒，每种聚合物纳米颗粒包含多臂芯聚合物和连接到多臂芯聚合物上的侧链聚合物，与树脂不混溶的多臂芯聚合物和可混溶的侧链聚合物 与树脂; 和溶剂，所述溶剂在第一温度下是挥发性的，所述树脂在第二温度下可交联，所述聚合物纳米颗粒可在第三温度下分解，所述第三温度高于所述第二温度，所述第二温度高于所述第一温度 其中在将所述层从所述第二温度加热到所述第三温度之间，所述组合物层的厚度收缩小于约3.5％。

公开(公告)号：DE69004914D1

公开(公告)日：1994-01-13

申请号：DE69004914

申请日：1990-08-30

Applicant: IBM

Inventor： HENDRICK JAMES LUPTON ,  HOFER DONALD CLIFFORD ,  LABADIE JEFFREY WILLIAM ,  SWANSON SALLY ANN ,  VOLKSEN WILLI

IPC: C08G73/06 ,  C08G73/10 ,  H01B3/30

Abstract: Block copolymers of polyimide and poly (phenylquinoxaline) are synthesized. They are useful as packaging materials in the electronics industry.

公开(公告)号：DE3472333D1

公开(公告)日：1988-07-28

申请号：DE3472333

申请日：1984-08-08

Applicant: IBM

Inventor： ECONOMY JAMES ,  SUSKO JOHN RICHARD ,  VOLKSEN WILLI ,  WHEATER ROBIN ANNE

IPC: C08G63/00 ,  C08G63/60 ,  C09J167/00 ,  C09K3/10 ,  H01B3/42 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

Abstract: Integrated circuit module wherein the cap is sealed to the substrate with a liquid crystalline polyester melt containing about 25 to about 100 mole percent of recurring Units I and about 75 to 0 mole percent of recurring Units II whereinandwherein each R and R, is arylene or cycloalkylene or alkylene or alkylidene.

公开(公告)号：DE3461935D1

公开(公告)日：1987-02-12

申请号：DE3461935

申请日：1984-02-08

Applicant: IBM

Inventor： ECONOMY JAMES ,  VOLKSEN WILLI ,  YOON DO YEUNG

IPC: C09D177/00 ,  B05D3/02 ,  B05D5/00 ,  B05D7/24 ,  C08G73/10 ,  C09D179/08 ,  C09D3/70

Abstract: A substrate is provided with a polyimide coating having good planarisation and good mechanical and thermal stability, by applying to the substrate an amino-terminated oligomer and an ester, with the oligomer being formed from an aromatic diamine and from an aromatic dianhydride, and by reacting the oligomer and the ester in situ. The ester is formed from an aromatic tetracarboxylic acid and an alcohol, and the ester is such that it reacts with an amine group of the oligomer to form a high molecular weight polyamide at a temperature between 40 DEG C and 140 DEG C, and continues to react to form a cyclic imide.

公开(公告)号：DE68917417T2

公开(公告)日：1995-03-16

申请号：DE68917417

申请日：1989-10-12

Applicant: IBM

Inventor： REE MOONHOR ,  SWANSON SALLY ANN ,  VOLKSEN WILLI ,  YOON DO YEUNG

IPC: C08J5/18 ,  C08L79/08 ,  C09J179/08 ,  H01B3/30

Abstract: Thin films of polyimide having electrical insulation, low thermal expansion, high glass transition temperature, and good ahesion are made by dispersing fine domains of relatively flexible polyimide which is fluorinated in a matrix of relatively rigid polyimide.

公开(公告)号：DE68917417D1

公开(公告)日：1994-09-15

申请号：DE68917417

申请日：1989-10-12

Applicant: IBM

Inventor： REE MOONHOR ,  SWANSON SALLY ANN ,  VOLKSEN WILLI ,  YOON DO YEUNG

IPC: C08J5/18 ,  C08L79/08 ,  C09J179/08 ,  H01B3/30

Abstract: Thin films of polyimide having electrical insulation, low thermal expansion, high glass transition temperature, and good ahesion are made by dispersing fine domains of relatively flexible polyimide which is fluorinated in a matrix of relatively rigid polyimide.

公开(公告)号：DE69004914T2

公开(公告)日：1994-05-19

申请号：DE69004914

申请日：1990-08-30

Applicant: IBM

Inventor： HENDRICK JAMES LUPTON ,  HOFER DONALD CLIFFORD ,  LABADIE JEFFREY WILLIAM ,  SWANSON SALLY ANN ,  VOLKSEN WILLI

IPC: C08G73/06 ,  C08G73/10 ,  H01B3/30

Abstract: Block copolymers of polyimide and poly (phenylquinoxaline) are synthesized. They are useful as packaging materials in the electronics industry.

公开(公告)号：CA1223782A

公开(公告)日：1987-07-07

申请号：CA508355

申请日：1986-05-05

Applicant: IBM

Inventor： HOFER DONALD C ,  LA VERGNE DEBRA B ,  TWIEG ROBERT J ,  VOLKSEN WILLI

IPC: H01L23/24

Abstract: PROCESS FOR PLANARIZING A SUBSTRATE A surface coating of high glass temperature and superior mechanical properties along with excellent planarization and gap filling is used to coat substrates. The coating comprises a polyamide alkyl ester from a pyromellitic alkyl diester and a para-linked aromatic diamine dissolved in a solvent containing at least 10% of a co-solvent boiling above 220.degree.C.