公开(公告)号：CA1148269A

公开(公告)日：1983-06-14

申请号：CA372670

申请日：1981-03-10

Applicant: IBM

Inventor： HORNG CHENG T ,  KONIAN RICHARD R ,  SCHWENKER ROBERT O ,  WIEDER ARMIN W

IPC: H01L21/331 ,  H01L21/762 ,  H01L21/8224 ,  H01L21/8228 ,  H01L27/082 ,  H01L29/10 ,  H01L29/423 ,  H01L29/73 ,  H01L29/732 ,  H01L29/735 ,  H01L27/04 ,  H01L21/72

Abstract: Disclosed is the fabrication and structure of very small integrated circuit devices of both PNP and NPN types with very high speeds and low power requirements. The structure provides vertical NPN and lateral PNP transistors formed within the same semiconductor chip. The base width of the lateral PNP transistor is very narrow (approximately 300 to 400 nanometers). This narrow dimension is in part obtained by using a well defined chemically vapor deposited (CVD) oxide mask instead of conventional lithographic masking. To eliminate the emitter current injecting into the substrate the P+ emitter and P+ collector of the PNP transistor are bounded by a silicon nitride and silicon dioxide dielectric layer. FI 9-79-014