公开(公告)号：JPH11289164A

公开(公告)日：1999-10-19

申请号：JP9499

申请日：1999-01-04

Applicant: IBM

Inventor： GERALD WALTER JONES ,  ROSS WILLIAM KIESLER ,  BOYER LISTA MARKOVICH ,  WILLIAM JOHN LUDICK ,  WILSON JAMES W ,  WILLIAM R WILSON

IPC: H01L21/48 ,  H05K3/00 ,  H05K3/16 ,  H05K3/38 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit structure comprising lamination and a plurality of internal flat surfaces of high wiring-density. SOLUTION: A method of manufacturing a circuit structure comprises a step, where an organic substrate 12 comprising a circuit 14 over it is provided, a step for coating a dielectric film 30 on the organic substrate 12, a step for forming a micro via in the dielectric film 30, a step for sputtering a metal seed layer 20 on the dielectric film 30 and in the micro via, a step for placing a metal layer 22 on the metal seed layer 20, and a step for forming a circuit pattern over it.