公开(公告)号：JPH11289164A

公开(公告)日：1999-10-19

申请号：JP9499

申请日：1999-01-04

Applicant: IBM

Inventor： GERALD WALTER JONES ,  ROSS WILLIAM KIESLER ,  BOYER LISTA MARKOVICH ,  WILLIAM JOHN LUDICK ,  WILSON JAMES W ,  WILLIAM R WILSON

IPC: H01L21/48 ,  H05K3/00 ,  H05K3/16 ,  H05K3/38 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit structure comprising lamination and a plurality of internal flat surfaces of high wiring-density. SOLUTION: A method of manufacturing a circuit structure comprises a step, where an organic substrate 12 comprising a circuit 14 over it is provided, a step for coating a dielectric film 30 on the organic substrate 12, a step for forming a micro via in the dielectric film 30, a step for sputtering a metal seed layer 20 on the dielectric film 30 and in the micro via, a step for placing a metal layer 22 on the metal seed layer 20, and a step for forming a circuit pattern over it.

公开(公告)号：CA2091910A1

公开(公告)日：1994-01-07

申请号：CA2091910

申请日：1993-03-18

Applicant: IBM

Inventor： FREY BRENDA D ,  JOSEPH CHARLES A ,  OLSHEFSKI FRANCIS J ,  WILSON JAMES W

IPC: H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/12 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/50 ,  H01L23/498

Abstract: A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 69.10 N/m . As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.

公开(公告)号：CA2126121A1

公开(公告)日：1995-02-04

申请号：CA2126121

申请日：1994-06-17

Applicant: IBM

Inventor： CHASE ALAN W ,  WILSON JAMES W

IPC: C08L75/04 ,  C08L75/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/12

Abstract: A chip carrier is disclosed which includes a chip carrier substrate and at least one semiconductor chip mounted in a flip chip configuration, via solder balls, on a circuitized surface of the chip carrier substrate. The solder balls are encapsulated in a first encapsulant having a composition which includes an epoxy. In addition, at least a portion of the circuitry on the circuitized surface is encapsulated in a second encapsulant having a composition which includes a urethane, and which composition is chosen so that the second encapsulant exhibits a modulus of elasticity which is equal to or less than about 10,000 psi. As a consequence, the second encapsulant exhibits neither internal cracks, nor interfacial cracks at the interface with the first encapsulant, nor does the second encapsulant delaminate from the circuitized surface, when the chip carrier is thermally cycled.