公开(公告)号：US3874525A

公开(公告)日：1975-04-01

申请号：US37527973

申请日：1973-06-29

Applicant: IBM

Inventor： HASSAN JAVATHU K ,  MACK ALFRED ,  WOJTASZEK MICHAEL R

IPC: B23Q7/14 ,  B25J15/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B65G65/30

CPC classification number: H01L21/68707 ,  B23Q7/1431 ,  B25J15/00 ,  B25J15/0052 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67742 ,  Y10S414/139

Abstract: A semiconductor wafer, which has chips formed thereon, is moved from a class 100 environment into a vacuum chamber in which pattern writing is performed on the chips by an electron beam without significantly affecting the vacuum level in the vacuum chamber. The wafer is initially disposed on an elevator, which is within the vacuum chamber, through an opening, which is vacuum sealed by the elevator at this time, in the top wall of the vacuum chamber. A lid is then placed over the opening from the exterior to cooperate with the elevator to form an ante chamber with the wafer disposed therein. The ante chamber, which is purged prior to the lid being placed over the opening, is then reduced to a vacuum of 5 X 10 2 torr. The elevator then lowers the wafer into a horizontal plane in which a transfer mechanism is located to transfer the wafer from the elevator to an X-Y table on which the wafer is mounted for pattern writing of the chips. The transfer mechanism includes an arm, which is indexed 180* during each activation of an indexing means connected thereto, and gripping means at each end of the arm to simultaneously grasp and release wafers on the elevator and the X-Y table to interchange the wafers between the elevator and the table.

Abstract translation: 其上形成有芯片的半导体晶片从100级环境移动到真空室中，其中通过电子束对芯片进行图案写入，而不会显着影响真空室中的真空水平。 最初将晶片设置在真空室内的电梯上，该电梯此时由电梯真空密封在真空室的顶壁中。 然后将盖子从外部放置在开口上方以与电梯配合以形成设置在其中的晶片的前室。 然后在盖子被放置在开口之前被清除的前室被减小到5×10 -2托的真空。 然后，电梯将晶片降低到水平平面中，在该水平平面中传送机构位于其中，以将晶片从电梯传送到安装有晶片的X-Y工作台，用于芯片的图案写入。 传送机构包括臂，在连接到其上的分度装置的每个激活期间被分度180度，并且在臂的每个端部处抓握装置，以同时在电梯和XY工作台上抓住并释放晶片，以将晶片在 电梯和桌子。