公开(公告)号：DE68911649D1

公开(公告)日：1994-02-03

申请号：DE68911649

申请日：1989-09-12

Applicant: IBM

Inventor： WILCOX JAMES ROBERT ,  WOYCHIK CHARLES GERARD

IPC: B23K20/00 ,  B23K1/00 ,  B23K35/00 ,  B23K35/26 ,  H01L21/52 ,  H05K3/34

公开(公告)号：DE68911649T2

公开(公告)日：1994-06-23

申请号：DE68911649

申请日：1989-09-12

Applicant: IBM

Inventor： WILCOX JAMES ROBERT ,  WOYCHIK CHARLES GERARD

IPC: B23K20/00 ,  B23K1/00 ,  B23K35/00 ,  B23K35/26 ,  H01L21/52 ,  H05K3/34

公开(公告)号：DE3871996T2

公开(公告)日：1993-01-14

申请号：DE3871996

申请日：1988-03-01

Applicant: IBM

Inventor： DESAI KISHOR VITHALDAS ,  FRANCHAK NELSON PETER ,  KATYL ROBERT HENRY ,  KOHN HAROLD ,  SHOLTES TAMAR ALANE ,  WOYCHIK CHARLES GERARD ,  VEERARAGHAVAN VILAKKUDI GOPALS

IPC: H01L21/60 ,  H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01L23/52

Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier (2) on a second level electronic package (4). The resulting electronic packaging structure includes electrically conductive spacers (10), such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads (11) on the flexible film semiconductor chip carrier and corresponding bonding pads (12) on the second level electronic package, and which physically support the flexible film (6) of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture (30) comprising a base plate (32), a pressure insert (34) with a resilient member (37), and a top plate (36). The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled, leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired. The spacers may be attached to the flexible film semiconductor chip carrier using a special template (15) having a pattern of openings (27) corresponding to the pattern of outer lead bonding pads on the flexible film semiconductor chip carrier.

公开(公告)号：DE3871996D1

公开(公告)日：1992-07-23

申请号：DE3871996

申请日：1988-03-01

Applicant: IBM

Inventor： DESAI KISHOR VITHALDAS ,  FRANCHAK NELSON PETER ,  KATYL ROBERT HENRY ,  KOHN HAROLD ,  SHOLTES TAMAR ALANE ,  WOYCHIK CHARLES GERARD ,  VEERARAGHAVAN VILAKKUDI GOPALS

IPC: H01L21/60 ,  H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01L23/52

Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier (2) on a second level electronic package (4). The resulting electronic packaging structure includes electrically conductive spacers (10), such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads (11) on the flexible film semiconductor chip carrier and corresponding bonding pads (12) on the second level electronic package, and which physically support the flexible film (6) of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture (30) comprising a base plate (32), a pressure insert (34) with a resilient member (37), and a top plate (36). The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled, leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired. The spacers may be attached to the flexible film semiconductor chip carrier using a special template (15) having a pattern of openings (27) corresponding to the pattern of outer lead bonding pads on the flexible film semiconductor chip carrier.