公开(公告)号：ES2114973T3

公开(公告)日：1998-06-16

申请号：ES93109877

申请日：1993-06-21

Applicant: IBM

Inventor： BARD STEVEN LINDZ ,  JONES JEFFREY DONALD ,  KATYL ROBERT HENRY ,  MOORE RONALD JAMES ,  MORENO OSCAR AUREO

IPC: B05C5/02 ,  B05D1/36 ,  B08B3/02 ,  C23F1/08 ,  F26B21/00 ,  H01L21/304 ,  H05K3/00 ,  H05K3/22 ,  H05K3/26

Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.

公开(公告)号：DE69317703D1

公开(公告)日：1998-05-07

申请号：DE69317703

申请日：1993-06-21

Applicant: IBM

Inventor： BARD STEVEN LINDZ ,  JONES JEFFREY DONALD ,  KATYL ROBERT HENRY ,  MOORE RONALD JAMES ,  MORENO OSCAR AUREO

IPC: B05C5/02 ,  B05D1/36 ,  B08B3/02 ,  C23F1/08 ,  F26B21/00 ,  H01L21/304 ,  H05K3/00 ,  H05K3/22 ,  H05K3/26

Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.

公开(公告)号：AT164722T

公开(公告)日：1998-04-15

申请号：AT93109877

申请日：1993-06-21

Applicant: IBM

Inventor： BARD STEVEN LINDZ ,  JONES JEFFREY DONALD ,  KATYL ROBERT HENRY ,  MOORE RONALD JAMES ,  MORENO OSCAR AUREO

IPC: B05C5/02 ,  B05D1/36 ,  B08B3/02 ,  C23F1/08 ,  F26B21/00 ,  H01L21/304 ,  H05K3/00 ,  H05K3/22 ,  H05K3/26

Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.

公开(公告)号：MY121570A

公开(公告)日：2006-02-28

申请号：MYPI9500452

申请日：1995-02-22

Applicant: IBM

Inventor： FRANKOSKI EDWARD JAY ,  JONES JEFFREY DONALD ,  KATYL ROBERT HENRY ,  RATCLIFF LYN BRAXTON

IPC: B05D3/10 ,  B08B3/00 ,  C23F1/02 ,  C23F1/08 ,  H05K3/00 ,  H05K3/06

Abstract: AN APPARATUS (10) FOR CHEMICALLY ETCHING THE COPPER FOIL OF A COPPER FOIL-CLAD SUBSTRATE (116) ARE DISCLOSED. SIGNIFICANTLY, THIS APPARATUS INCLUDES FLUID JET INJECTORS (70-1, 70-2, 80-2) WHICH SERVE TO PRODUCE JETS OF CHEMICAL ETCHANT. THESE FLUID JET INJECTORS ARE ARRANGED SO AS TO SIMULTANEOUSLY ACHIEVE A RELATIVELY HIGH ETCH RATE AND A RELATIVELY HIGH ETCH UNIFORMITY. (FIG. 1)

公开(公告)号：DE69317703T2

公开(公告)日：1998-10-29

申请号：DE69317703

申请日：1993-06-21

Applicant: IBM

Inventor： BARD STEVEN LINDZ ,  JONES JEFFREY DONALD ,  KATYL ROBERT HENRY ,  MOORE RONALD JAMES ,  MORENO OSCAR AUREO

IPC: B05C5/02 ,  B05D1/36 ,  B08B3/02 ,  C23F1/08 ,  F26B21/00 ,  H01L21/304 ,  H05K3/00 ,  H05K3/22 ,  H05K3/26

Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.

公开(公告)号：SG44399A1

公开(公告)日：1997-12-19

申请号：SG1996000148

申请日：1993-06-21

Applicant: IBM

Inventor： BARD STEVEN LINDZ ,  JONES JEFFREY DONALD ,  KATYL ROBERT HENRY ,  MOORE RONALD JAMES ,  MORENO OSCAR AUREO

IPC: B05C5/02 ,  B05D1/36 ,  B08B3/02 ,  C23F1/08 ,  F26B21/00 ,  H01L21/304 ,  H05K3/00 ,  H05K3/22 ,  H05K3/26

Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.

公开(公告)号：SG28203A1

公开(公告)日：1996-04-01

申请号：SG1995000055

申请日：1995-03-04

Applicant: IBM

Inventor： FRANKOSKI EDWARD JAY ,  JONES JEFFREY DONALD ,  KATYL ROBERT HENRY ,  RATCLIFF LYN BRAXTON

IPC: H01L21/302

公开(公告)号：DE3871996T2

公开(公告)日：1993-01-14

申请号：DE3871996

申请日：1988-03-01

Applicant: IBM

Inventor： DESAI KISHOR VITHALDAS ,  FRANCHAK NELSON PETER ,  KATYL ROBERT HENRY ,  KOHN HAROLD ,  SHOLTES TAMAR ALANE ,  WOYCHIK CHARLES GERARD ,  VEERARAGHAVAN VILAKKUDI GOPALS

IPC: H01L21/60 ,  H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01L23/52

Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier (2) on a second level electronic package (4). The resulting electronic packaging structure includes electrically conductive spacers (10), such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads (11) on the flexible film semiconductor chip carrier and corresponding bonding pads (12) on the second level electronic package, and which physically support the flexible film (6) of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture (30) comprising a base plate (32), a pressure insert (34) with a resilient member (37), and a top plate (36). The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled, leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired. The spacers may be attached to the flexible film semiconductor chip carrier using a special template (15) having a pattern of openings (27) corresponding to the pattern of outer lead bonding pads on the flexible film semiconductor chip carrier.

公开(公告)号：DE3871996D1

公开(公告)日：1992-07-23

申请号：DE3871996

申请日：1988-03-01

Applicant: IBM

Inventor： DESAI KISHOR VITHALDAS ,  FRANCHAK NELSON PETER ,  KATYL ROBERT HENRY ,  KOHN HAROLD ,  SHOLTES TAMAR ALANE ,  WOYCHIK CHARLES GERARD ,  VEERARAGHAVAN VILAKKUDI GOPALS

IPC: H01L21/60 ,  H01L21/98 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01L23/52

Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier (2) on a second level electronic package (4). The resulting electronic packaging structure includes electrically conductive spacers (10), such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads (11) on the flexible film semiconductor chip carrier and corresponding bonding pads (12) on the second level electronic package, and which physically support the flexible film (6) of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture (30) comprising a base plate (32), a pressure insert (34) with a resilient member (37), and a top plate (36). The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled, leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired. The spacers may be attached to the flexible film semiconductor chip carrier using a special template (15) having a pattern of openings (27) corresponding to the pattern of outer lead bonding pads on the flexible film semiconductor chip carrier.