公开(公告)号：DE68907033T2

公开(公告)日：1993-12-02

申请号：DE68907033

申请日：1989-11-16

Applicant: IBM

Inventor： CHANG CHIN-AN ,  KOOPMAN NICHOLAS GEORGE ,  ROLDAN JUDITH MARIE ,  STRICKMAN STEVEN ,  SRIVASTAVA KAMALESH KUMAR ,  YEH HELEN LI

IPC: B23K1/00 ,  B23K1/20 ,  B23K35/00 ,  B23K35/14 ,  B23K101/40 ,  H01L21/60 ,  H01R43/02 ,  H05K3/34 ,  B23K35/24 ,  H01L21/58

公开(公告)号：DE3669953D1

公开(公告)日：1990-05-03

申请号：DE3669953

申请日：1986-07-08

Applicant: IBM

Inventor： BRUSIC VLASTA AGNES ,  ELMGREN PETER JARL ,  OWEN CHARLES JAMES ,  SISSENSTEIN JR ,  YEH HELEN LI

IPC: B23K1/00 ,  B23K1/008 ,  B23K35/36 ,  B23K35/38 ,  B23K101/42 ,  H05K3/34 ,  H01L21/60

Abstract: An integrated circuit chip is joined to a substrate by first applying solder to the substrate and/or the IC chip, and then applying diol and /or polyol and/or ether derivatives thereof to the substrate. The IC chip is placed in contact with the applied diol/polyol and the resulting assembly is heated in a reducing atmosphere. This process avoids the application of liquid flux compositions and the necessity to remove the flux or flux residues in separate cleaning steps.

公开(公告)号：DE68907033D1

公开(公告)日：1993-07-15

申请号：DE68907033

申请日：1989-11-16

Applicant: IBM

Inventor： CHANG CHIN-AN ,  KOOPMAN NICHOLAS GEORGE ,  ROLDAN JUDITH MARIE ,  STRICKMAN STEVEN ,  SRIVASTAVA KAMALESH KUMAR ,  YEH HELEN LI

IPC: B23K1/00 ,  B23K1/20 ,  B23K35/00 ,  B23K35/14 ,  B23K101/40 ,  H01L21/60 ,  H01R43/02 ,  H05K3/34 ,  B23K35/24 ,  H01L21/58