公开(公告)号：DE2961610D1

公开(公告)日：1982-02-11

申请号：DE2961610

申请日：1979-08-23

Applicant: IBM

Inventor： KOOPMAN NICHOLAS GEORGE ,  MARCOTTE VINCENT CHARLES ,  TEED STEPHEN

IPC: H05K3/34 ,  B23K1/00 ,  B23K35/26 ,  B23K35/36 ,  B23K35/363 ,  H01L21/60 ,  H01L23/485 ,  H01L23/488 ,  B23K1/02 ,  H01L23/48

公开(公告)号：DE3379820D1

公开(公告)日：1989-06-08

申请号：DE3379820

申请日：1983-06-01

Applicant: IBM

Inventor： BHATTACHARYA SOMNATH ,  CHANCE DUDLEY AUGUSTUS ,  KOOPMAN NICHOLAS GEORGE ,  RAY SUDIPTA KUMAR

IPC: H01L23/52 ,  H01L23/498 ,  H01L23/538 ,  H05K3/24

Abstract: A method of preparing a conductor for solder bonding and a substrate to which this method may be applied. The method involves the use of three layers comprising a conductor layer 32, a barrier layer 33 and a solder wettable layer 35'. Solder bonds may be made to this solder wettable layer. During thermal cycling there may, in the absence of the barrier layer, be a tendency for material from the conductor layer to diffuse into the solder wettable layer and thence into the solder where it can form intermetallic alloys with Sn in the solder, causing the solder to become brittle and liable to failure. The inclusion of a barrier layer of suitable material, eg Cr or Co, reduces this diffusion and hence increases the reliability of the solder bonds. Optionally, the method includes provision for solderless bonding by thermocompression or ultrasonic bonding. This may be performed on the barrier layer at 37 or it may be performed elsewhere.

公开(公告)号：DE68907033T2

公开(公告)日：1993-12-02

申请号：DE68907033

申请日：1989-11-16

Applicant: IBM

Inventor： CHANG CHIN-AN ,  KOOPMAN NICHOLAS GEORGE ,  ROLDAN JUDITH MARIE ,  STRICKMAN STEVEN ,  SRIVASTAVA KAMALESH KUMAR ,  YEH HELEN LI

IPC: B23K1/00 ,  B23K1/20 ,  B23K35/00 ,  B23K35/14 ,  B23K101/40 ,  H01L21/60 ,  H01R43/02 ,  H05K3/34 ,  B23K35/24 ,  H01L21/58

公开(公告)号：MX148284A

公开(公告)日：1983-04-07

申请号：MX17045677

申请日：1977-09-02

Applicant: IBM

Inventor： KOOPMAN NICHOLAS GEORGE ,  TOTTA PAUL ANTHONY

IPC: H01L23/14 ,  H01L27/00

公开(公告)号：DE68907033D1

公开(公告)日：1993-07-15

申请号：DE68907033

申请日：1989-11-16

Applicant: IBM

Inventor： CHANG CHIN-AN ,  KOOPMAN NICHOLAS GEORGE ,  ROLDAN JUDITH MARIE ,  STRICKMAN STEVEN ,  SRIVASTAVA KAMALESH KUMAR ,  YEH HELEN LI

IPC: B23K1/00 ,  B23K1/20 ,  B23K35/00 ,  B23K35/14 ,  B23K101/40 ,  H01L21/60 ,  H01R43/02 ,  H05K3/34 ,  B23K35/24 ,  H01L21/58

公开(公告)号：DE3278896D1

公开(公告)日：1988-09-15

申请号：DE3278896

申请日：1982-04-15

Applicant: IBM

Inventor： BHATTACHARYA SOMNATH ,  KOOPMAN NICHOLAS GEORGE ,  TOTTA PAUL ANTHONY

IPC: H05K1/18 ,  H01L21/60 ,  H01L23/485 ,  H01L23/48

公开(公告)号：DE2729074A1

公开(公告)日：1978-03-09

申请号：DE2729074

申请日：1977-06-28

Applicant: IBM

Inventor： KOOPMAN NICHOLAS GEORGE ,  TOTTA PAUL ANTHONY

IPC: H01L23/373 ,  H01L23/433 ,  H01L23/36 ,  H05K7/20

Abstract: The operational heat of a semiconductor chip (1) is transferred to a cooling can (5) by means of a metal cushion (7). The metal cushion is permanently connected to the can or the chip on one side whilst its opposite side is in loose contact. This creates a connection of high thermal conductivity without exposing the chip to inadmissible mechanical stresses.

公开(公告)号：DE3276841D1

公开(公告)日：1987-08-27

申请号：DE3276841

申请日：1982-03-01

Applicant: IBM

Inventor： BHATTACHARYA SOMNATH ,  HU SHIH-MING ,  KOOPMAN NICHOLAS GEORGE ,  OLDAKOWSKI CHESTER CHARLES

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/532 ,  H01L23/48

Abstract: A controlled geometric configuration of contact pads (1) for securing solder mounds to semiconductor chip reduces cracking of brittle passivating coatings (58) in the fabrication of components. A bottom Cr layer (2), a concentric intermediate Cr/Cu layer (4) and a top Cu layer (3) have tapered, wedge-shaped peripheral portions. The intermediate and the top layers have about the same diameter, whereas the bottom layer is larger.

公开(公告)号：CH614810A5

公开(公告)日：1979-12-14

申请号：CH823877

申请日：1977-07-05

Applicant: IBM

Inventor： KOOPMAN NICHOLAS GEORGE ,  TOTTA PAUL ANTHONY

IPC: H01L23/373 ,  H01L23/433 ,  H01L23/34 ,  H01L21/50