公开(公告)号：JP2002151170A

公开(公告)日：2002-05-24

申请号：JP2001210998

申请日：2001-07-11

Applicant: IBM

Inventor： GRAHAM TERESITA O ,  KANG SUNG K ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH MARIE ,  SARAF RAVI F

IPC: C08K9/02 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  C08L101/00 ,  C09D5/24 ,  C09J9/02 ,  C09J11/00 ,  C09J11/02 ,  C09J11/04 ,  C09J101/02 ,  C09J183/08 ,  C09J191/00 ,  C09J197/00 ,  C09J201/00 ,  C23C24/08 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H05K1/18 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To provide conductive paste material safe for the environment and manufacturable at a low cost. SOLUTION: The paste material is made from a polymeride material and particles of Cu, etc., having conductive coatings, for example Sn coating. Coupling is established by melting the coatings of adjoining particles with heat. The polymeride material should be of thermoplastic type and is applied to two surfaces having electric conductivity, for example between a chip and the pad of a substrate so that electric connection and adhesion between the pads are established.

公开(公告)号：SG72751A1

公开(公告)日：2000-05-23

申请号：SG1997002768

申请日：1997-08-02

Applicant: IBM

Inventor： BROUILLETTE GUY PAUL ,  DANOVITCH DAVID HIRSCH ,  LIEHR MICHAEL ,  MOTSIFF WILLIAM THOMAS ,  ROLDAN JUDITH MARIE ,  SAMBUCETTI CARLOS JUAN ,  SARAF RAVI F

IPC: H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34 ,  H01L21/44 ,  H01L21/98

Abstract: An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.

公开(公告)号：SG77619A1

公开(公告)日：2001-01-16

申请号：SG1997004678

申请日：1995-08-21

Applicant: IBM

Inventor： KANG SUNG K ,  GRAHAM TERESITA O ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH MARIE ,  SARAF RAVI F

IPC: C08K9/02 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  C08L101/00 ,  C09D5/24 ,  C09J9/02 ,  C09J11/00 ,  C09J11/02 ,  C09J11/04 ,  C09J101/02 ,  C09J183/08 ,  C09J191/00 ,  C09J197/00 ,  C09J201/00 ,  C23C24/08 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H05K1/18 ,  H05K3/32

Abstract: A structure and method of fabrication are described. The structure is a combination of a polymeric material (36) and particles (32), e.g. Cu, having an electrically conductive coating (34), e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material (36) is a thermoplastic. The structure is disposed between two electrically conductive surfaces (40,42), e.g. chip and substrate pads, to provide electrical interconnection and adhesion between their pads.

公开(公告)号：HK1006241A1

公开(公告)日：1999-02-19

申请号：HK98105469

申请日：1998-06-17

Applicant: IBM

Inventor： BROUILLETTE GUY PAUL ,  DANOVITCH DAVID HIRSCH ,  LIEHR MICHAEL ,  MOTSIFF WILLIAM THOMAS ,  ROLDAN JUDITH MARIE ,  SAMBUCETTI CARLOS JUAN

IPC: H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34 ,  H01L

Abstract: An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.

公开(公告)号：MY118121A

公开(公告)日：2004-09-30

申请号：MYPI9502913

申请日：1995-09-29

Applicant: IBM

Inventor： KANG SUNG K ,  GRAHAM TERESITA O ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH MARIE ,  SARAF RAVI F

IPC: C08K9/02 ,  H05K3/32 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  C08L101/00 ,  C09D5/24 ,  C09J9/02 ,  C09J11/00 ,  C09J11/02 ,  C09J11/04 ,  C09J101/02 ,  C09J183/08 ,  C09J191/00 ,  C09J197/00 ,  C09J201/00 ,  C23C24/08 ,  H01B1/00 ,  H01B1/22 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H05K1/18

Abstract: A STRUCTURE AND METHOD OF FABRICATION ARE DESCRIBED. THE STRUCTURE (30) IS A COMBINATION OF A POLYMERIC MATERIAL (36) AND PARTICLES (32), E.G. CU, HAYING AN ELECTRICALLY CONDUCTIYE COATING (34), E.G. SN. HEAT IS APPLIED TO FUSE THE COATING OF ADJACENT PARTICLES. THE POLYMERIC MATERIAL IS A THERMOPLASTIC. THE STRUCTURE IS DISPOSED BETWEEN TWO ELECTRICALLY CONDUCTIYE SURFACES (40, 42), E.G. CHIP AND SUBSTRATE PADS, TO PROYIDE ELECTRICAL INTERCONNECTION AND ADHESION BETWEEN THEIR PADS. (FIGURE 3)

公开(公告)号：DE68907033D1

公开(公告)日：1993-07-15

申请号：DE68907033

申请日：1989-11-16

Applicant: IBM

Inventor： CHANG CHIN-AN ,  KOOPMAN NICHOLAS GEORGE ,  ROLDAN JUDITH MARIE ,  STRICKMAN STEVEN ,  SRIVASTAVA KAMALESH KUMAR ,  YEH HELEN LI

IPC: B23K1/00 ,  B23K1/20 ,  B23K35/00 ,  B23K35/14 ,  B23K101/40 ,  H01L21/60 ,  H01R43/02 ,  H05K3/34 ,  B23K35/24 ,  H01L21/58

公开(公告)号：MY125463A

公开(公告)日：2006-08-30

申请号：MYPI9703540

申请日：1997-08-04

Applicant: IBM

Inventor： BROUILLETTE GUY PAUL ,  DANOVITCH DAVID HIRSCH ,  LIEHR MICHAEL ,  MOTSIFF WILLIAM THOMAS ,  ROLDAN JUDITH MARIE ,  SAMBUCETTI CARLOS JUAN ,  SARAF RAVI F

IPC: H01L21/44 ,  H01L21/60 ,  H01L23/556 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/34

Abstract: AN INTERCONNECT SYSTEM THAT HAS LOW ALPHA PARTICLE EMISSION CHARACTERISTICS FOR USE IN AN ELECTRONIC DEVICE INCLUDES A SEMICONDUCTOR CHIP (12) THAT HAS AN UPPER SURFACE AND SPACED APART ELECTRICALLY RESISTIVE BUMPS (26,36) POSITIONED ON CONDUCTIVE REGIONS OF THE UPPER SURFACE, THE ELECTRICALLY RESISTIVE BUMPS ARE MADE OF A COMPOSITE MATERIAL OF A POLYMER AND METAL PARTICLES, AND A SUBSTRATE (10) THAT HAS CONDUCTIVE REGIONS BONDED TO THE ELECTRICALLY RESISTIVE BUMPS IN A BONDING PROCESS WHEREIN THE ELECTRICALLY RESISTIVE BUMPS CONVERT TO ELECTRICALLY CONDUCTIVE BUMPS AFTER THE BONDING PROCESS.(FIG.3)

公开(公告)号：SG49985A1

公开(公告)日：1998-06-15

申请号：SG1996011044

申请日：1996-11-04

Applicant: IBM

Inventor： SARAF RAVI F ,  ROLDAN JUDITH MARIE ,  GAYNES MICHAEL ANTHONY ,  BOOTH RICHARD BENTON ,  OSTRANDER STEPHEN PAUL ,  COOPER EMANUEL I ,  SAMBUCETTI CARLOS J

IPC: B23K35/24 ,  B23K35/30 ,  H01B1/22 ,  H01L23/488 ,  H01L23/50 ,  H01R43/02 ,  H05K3/10

公开(公告)号：SG33468A1

公开(公告)日：1996-10-18

申请号：SG1995001167

申请日：1995-08-21

Applicant: IBM

Inventor： KANG SUNG K ,  GRAHAM TERESITA O ,  PURUSHOTHAMAN SAMPATH ,  ROLDAN JUDITH MARIE ,  SARAF RAVI F

IPC: H01R4/02 ,  H05K3/34 ,  H05K3/42

公开(公告)号：DE69116422D1

公开(公告)日：1996-02-29

申请号：DE69116422

申请日：1991-02-08

Applicant: IBM

Inventor： AHN BYUNG TAE ,  BEYERS ROBERT BRUCE ,  COOPER EMANUEL ISRAEL ,  GIESS EDWARD AUGUST ,  O'SULLIVAN EUGENE JOHN ,  ROLDAN JUDITH MARIE ,  ROMANKIW LUBOMYR TARAS

IPC: C01G1/00 ,  C01G29/00 ,  C04B35/00 ,  C04B35/45 ,  H01B12/06 ,  H01B13/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L39/02 ,  H01L39/24 ,  H01L39/08 ,  H01L21/768 ,  C04B41/51

Abstract: A superconducting multilayer ceramic substrate is disclosed, prepared by firing a laminate of at least two polymer bonded cast sheets of a ceramic dielectric oxide powder, at least one sheet of which has a metallization pattern provided thereon, to thereby form a superconducting oxide reaction layer at the interface between the sintered ceramic material and the embedded metallic conductor lines of the metallization pattern.