公开(公告)号：DE68905001T2

公开(公告)日：1993-09-16

申请号：DE68905001

申请日：1989-06-10

Applicant: IBM

Inventor： BICKFORD HARRY R ,  HORTON RAYMOND R ,  NOYAN ISMAIL C ,  PALMER MICHAEL J ,  ZYZO JOHN C

IPC: B23K1/012 ,  H01L21/00 ,  H01L21/60 ,  H05K3/34 ,  B23K1/00

Abstract: Method and apparatus for fluxlessly solder bonding a solder mound (2) to a solder wettable surface (8,10). A heated gas (12), preferably a reducing or non-reactive gas, is directed at a solid solder mound (2). Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound (2) at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound (2). Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.

公开(公告)号：DE68905001D1

公开(公告)日：1993-04-01

申请号：DE68905001

申请日：1989-06-10

Applicant: IBM

Inventor： BICKFORD HARRY R ,  HORTON RAYMOND R ,  NOYAN ISMAIL C ,  PALMER MICHAEL J ,  ZYZO JOHN C

IPC: B23K1/012 ,  H01L21/00 ,  H01L21/60 ,  H05K3/34 ,  B23K1/00

Abstract: Method and apparatus for fluxlessly solder bonding a solder mound (2) to a solder wettable surface (8,10). A heated gas (12), preferably a reducing or non-reactive gas, is directed at a solid solder mound (2). Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound (2) at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound (2). Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.