公开(公告)号：DE68919007D1

公开(公告)日：1994-12-01

申请号：DE68919007

申请日：1989-05-26

Applicant: IBM

Inventor： BICKFORD HARRY R ,  GREBE KURT R ,  PALMER MICHAEL J ,  KOVAC CAROLINE A

IPC: B23K3/06 ,  B23K35/14 ,  B23K35/40 ,  H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H05K13/04

Abstract: This invention employs a carrier (10) upon which a thin conductive film (12) has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask (14) is disposed on the conductive film, with the mask having openings which expose selected areas (16, 18) of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas (20, 22) of a circuit carrier (24), such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse. In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

公开(公告)号：DE68905001D1

公开(公告)日：1993-04-01

申请号：DE68905001

申请日：1989-06-10

Applicant: IBM

Inventor： BICKFORD HARRY R ,  HORTON RAYMOND R ,  NOYAN ISMAIL C ,  PALMER MICHAEL J ,  ZYZO JOHN C

IPC: B23K1/012 ,  H01L21/00 ,  H01L21/60 ,  H05K3/34 ,  B23K1/00

Abstract: Method and apparatus for fluxlessly solder bonding a solder mound (2) to a solder wettable surface (8,10). A heated gas (12), preferably a reducing or non-reactive gas, is directed at a solid solder mound (2). Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound (2) at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound (2). Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.

公开(公告)号：DE68919007T2

公开(公告)日：1995-05-04

申请号：DE68919007

申请日：1989-05-26

Applicant: IBM

Inventor： BICKFORD HARRY R ,  GREBE KURT R ,  PALMER MICHAEL J ,  KOVAC CAROLINE A

IPC: B23K3/06 ,  B23K35/14 ,  B23K35/40 ,  H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H05K13/04

Abstract: This invention employs a carrier (10) upon which a thin conductive film (12) has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask (14) is disposed on the conductive film, with the mask having openings which expose selected areas (16, 18) of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas (20, 22) of a circuit carrier (24), such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse. In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

公开(公告)号：DE68910215D1

公开(公告)日：1993-12-02

申请号：DE68910215

申请日：1989-05-24

Applicant: IBM

Inventor： BICKFORD HARRY R ,  MOK LAWRENCE S ,  PALMER MICHAEL J

IPC: H01L23/34 ,  H01L21/60 ,  H01L23/13 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50

Abstract: A TAB package is described which includes a flexible dielectric film (30) with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads (31), which leads extend into the aperture and connect to a semiconductor chip (34). Thermally conductive body means (10) is provided which has a well (18) formed therein, the well defined by a lip (22) comprising the outer rim (20) of the body means. The back face of the semiconductor chip is thermally connected to the thermally conductive body means (10) and the flexible dielectric film (30) is formed to conform to the surface of the well and to extend over its rim whereby the beam leads also conform to the well and rim structure. The beam leads are thereby made available for electrical connection in the vicinity of the rim. Means (40, 42) are also provided for attaching the outer edge of the film to the thermally conductive body means so as to enable flexure of the film in the event of differential expansion or contraction at connection points.

公开(公告)号：DE68910215T2

公开(公告)日：1994-05-05

申请号：DE68910215

申请日：1989-05-24

Applicant: IBM

Inventor： BICKFORD HARRY R ,  MOK LAWRENCE S ,  PALMER MICHAEL J

IPC: H01L23/34 ,  H01L21/60 ,  H01L23/13 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50

Abstract: A TAB package is described which includes a flexible dielectric film (30) with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads (31), which leads extend into the aperture and connect to a semiconductor chip (34). Thermally conductive body means (10) is provided which has a well (18) formed therein, the well defined by a lip (22) comprising the outer rim (20) of the body means. The back face of the semiconductor chip is thermally connected to the thermally conductive body means (10) and the flexible dielectric film (30) is formed to conform to the surface of the well and to extend over its rim whereby the beam leads also conform to the well and rim structure. The beam leads are thereby made available for electrical connection in the vicinity of the rim. Means (40, 42) are also provided for attaching the outer edge of the film to the thermally conductive body means so as to enable flexure of the film in the event of differential expansion or contraction at connection points.

公开(公告)号：DE68905001T2

公开(公告)日：1993-09-16

申请号：DE68905001

申请日：1989-06-10

Applicant: IBM

Inventor： BICKFORD HARRY R ,  HORTON RAYMOND R ,  NOYAN ISMAIL C ,  PALMER MICHAEL J ,  ZYZO JOHN C

IPC: B23K1/012 ,  H01L21/00 ,  H01L21/60 ,  H05K3/34 ,  B23K1/00

Abstract: Method and apparatus for fluxlessly solder bonding a solder mound (2) to a solder wettable surface (8,10). A heated gas (12), preferably a reducing or non-reactive gas, is directed at a solid solder mound (2). Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound (2) at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound (2). Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.