公开(公告)号：DE68919007D1

公开(公告)日：1994-12-01

申请号：DE68919007

申请日：1989-05-26

Applicant: IBM

Inventor： BICKFORD HARRY R ,  GREBE KURT R ,  PALMER MICHAEL J ,  KOVAC CAROLINE A

IPC: B23K3/06 ,  B23K35/14 ,  B23K35/40 ,  H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H05K13/04

Abstract: This invention employs a carrier (10) upon which a thin conductive film (12) has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask (14) is disposed on the conductive film, with the mask having openings which expose selected areas (16, 18) of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas (20, 22) of a circuit carrier (24), such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse. In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

公开(公告)号：DE69118442T2

公开(公告)日：1996-10-10

申请号：DE69118442

申请日：1991-05-15

Applicant: IBM

Inventor： GOLDBERG MARTIN J ,  ITO HIROSHI ,  KOVAC CAROLINE A ,  PALMER MICHAEL J ,  POLLAK ROGER A ,  POORE PAIGE A

IPC: B23K1/00 ,  B23K35/22 ,  B23K35/34 ,  B23K101/40 ,  H05K3/10 ,  H05K3/34

Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

公开(公告)号：DE68905001D1

公开(公告)日：1993-04-01

申请号：DE68905001

申请日：1989-06-10

Applicant: IBM

Inventor： BICKFORD HARRY R ,  HORTON RAYMOND R ,  NOYAN ISMAIL C ,  PALMER MICHAEL J ,  ZYZO JOHN C

IPC: B23K1/012 ,  H01L21/00 ,  H01L21/60 ,  H05K3/34 ,  B23K1/00

Abstract: Method and apparatus for fluxlessly solder bonding a solder mound (2) to a solder wettable surface (8,10). A heated gas (12), preferably a reducing or non-reactive gas, is directed at a solid solder mound (2). Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound (2) at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound (2). Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.

公开(公告)号：GB2343596A

公开(公告)日：2000-05-10

申请号：GB9824228

申请日：1998-11-06

Applicant: IBM

Inventor： GRAY MANDY ALEXANDER ,  PALMER MICHAEL J ,  JUDD IAN DAVID

IPC: H04L12/933 ,  H04L12/403 ,  G06F13/362

Abstract: For connecting together, in a VLSI chip, a plurality of macros which require data flow connections between each other, a simple standard interface is realised between all macros. Any number of macros can be connected together, also allowing concurrent transactions between 4 or more macros using a cross-bar switch. Each macro may be a master (capable of requesting connections), a slave (capable of receiving connections from a master) or both. The centralised inter-connect logic includes three major components: the cross-bar switch, which makes the connections between the macros, the address decoder, which determines which slave each master wishes to connect to and an arbiter, which arbitrates between the macros when two or more masters request a connection simultaneously.

公开(公告)号：DE68910215T2

公开(公告)日：1994-05-05

申请号：DE68910215

申请日：1989-05-24

Applicant: IBM

Inventor： BICKFORD HARRY R ,  MOK LAWRENCE S ,  PALMER MICHAEL J

IPC: H01L23/34 ,  H01L21/60 ,  H01L23/13 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50

Abstract: A TAB package is described which includes a flexible dielectric film (30) with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads (31), which leads extend into the aperture and connect to a semiconductor chip (34). Thermally conductive body means (10) is provided which has a well (18) formed therein, the well defined by a lip (22) comprising the outer rim (20) of the body means. The back face of the semiconductor chip is thermally connected to the thermally conductive body means (10) and the flexible dielectric film (30) is formed to conform to the surface of the well and to extend over its rim whereby the beam leads also conform to the well and rim structure. The beam leads are thereby made available for electrical connection in the vicinity of the rim. Means (40, 42) are also provided for attaching the outer edge of the film to the thermally conductive body means so as to enable flexure of the film in the event of differential expansion or contraction at connection points.

公开(公告)号：DE68905001T2

公开(公告)日：1993-09-16

申请号：DE68905001

申请日：1989-06-10

Applicant: IBM

Inventor： BICKFORD HARRY R ,  HORTON RAYMOND R ,  NOYAN ISMAIL C ,  PALMER MICHAEL J ,  ZYZO JOHN C

IPC: B23K1/012 ,  H01L21/00 ,  H01L21/60 ,  H05K3/34 ,  B23K1/00

Abstract: Method and apparatus for fluxlessly solder bonding a solder mound (2) to a solder wettable surface (8,10). A heated gas (12), preferably a reducing or non-reactive gas, is directed at a solid solder mound (2). Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound (2) at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound (2). Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.

公开(公告)号：CA2024012A1

公开(公告)日：1991-02-26

申请号：CA2024012

申请日：1990-08-24

Applicant: IBM

Inventor： KANG SUNG K ,  PALMER MICHAEL J ,  REILEY TIMOTHY C ,  TOPA ROBERT D

IPC: B23K20/02 ,  B23K20/233 ,  B23K33/00 ,  H01L21/60 ,  H01L21/603

Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

公开(公告)号：DE69118442D1

公开(公告)日：1996-05-09

申请号：DE69118442

申请日：1991-05-15

Applicant: IBM

Inventor： GOLDBERG MARTIN J ,  ITO HIROSHI ,  KOVAC CAROLINE A ,  PALMER MICHAEL J ,  POLLAK ROGER A ,  POORE PAIGE A

IPC: B23K1/00 ,  B23K35/22 ,  B23K35/34 ,  B23K101/40 ,  H05K3/10 ,  H05K3/34

Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

公开(公告)号：DE68919007T2

公开(公告)日：1995-05-04

申请号：DE68919007

申请日：1989-05-26

Applicant: IBM

Inventor： BICKFORD HARRY R ,  GREBE KURT R ,  PALMER MICHAEL J ,  KOVAC CAROLINE A

IPC: B23K3/06 ,  B23K35/14 ,  B23K35/40 ,  H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H05K13/04

Abstract: This invention employs a carrier (10) upon which a thin conductive film (12) has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask (14) is disposed on the conductive film, with the mask having openings which expose selected areas (16, 18) of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas (20, 22) of a circuit carrier (24), such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse. In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

公开(公告)号：DE68910215D1

公开(公告)日：1993-12-02

申请号：DE68910215

申请日：1989-05-24

Applicant: IBM

Inventor： BICKFORD HARRY R ,  MOK LAWRENCE S ,  PALMER MICHAEL J

IPC: H01L23/34 ,  H01L21/60 ,  H01L23/13 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50

Abstract: A TAB package is described which includes a flexible dielectric film (30) with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads (31), which leads extend into the aperture and connect to a semiconductor chip (34). Thermally conductive body means (10) is provided which has a well (18) formed therein, the well defined by a lip (22) comprising the outer rim (20) of the body means. The back face of the semiconductor chip is thermally connected to the thermally conductive body means (10) and the flexible dielectric film (30) is formed to conform to the surface of the well and to extend over its rim whereby the beam leads also conform to the well and rim structure. The beam leads are thereby made available for electrical connection in the vicinity of the rim. Means (40, 42) are also provided for attaching the outer edge of the film to the thermally conductive body means so as to enable flexure of the film in the event of differential expansion or contraction at connection points.