Abstract:
The magnetization reversal method involves applying external magnetic field to a magnetized layer (3) such that magnetization processes around external magnetic field. The external magnetic field is maintained until precision suffices to effect magnetization reversal. Independent claims are also included for the following: (a) magnetization reversal device;; (b) in plane magnetized method; (c) magnetic recording system.
Abstract:
The magnetization reversal method involves applying external magnetic field to a magnetized layer (3) such that magnetization processes around external magnetic field. The external magnetic field is maintained until precision suffices to effect magnetization reversal. Independent claims are also included for the following: (a) magnetization reversal device;; (b) in plane magnetized method; (c) magnetic recording system.
Abstract:
A SCHEME FOR ULTRAFAST MAGNETIZATION REVERSAL IN AN IN-PLANE MAGNETIZED LAYER (3) IS DISCLOSED. FOR THAT, AN EXTERNAL MAGNETIC FIELD Hex IS APPLIED SUCH THAT THE MAGNETIZATION M PROCESSES AROUND THE EXTERNAL MAGNETIC FIELD Hex AND THE EXTERNAL MAGNETIC FIELD Hex IS MAINTAINED UNTIL THE PRECESSION SUFFICES TO EFFECT THE MAGNETIZATION REVERSAL. THE EXTERNAL MAGNETIC FIELD Hex IS APPLIED APPROXIMATELY PERPENDICULAR TO THE MAGNETIZATION M.FIG. 1
Abstract:
The magnetization reversal method involves applying external magnetic field to a magnetized layer (3) such that magnetization processes around external magnetic field. The external magnetic field is maintained until precision suffices to effect magnetization reversal. Independent claims are also included for the following: (a) magnetization reversal device;; (b) in plane magnetized method; (c) magnetic recording system.
Abstract:
The magnetization reversal method involves applying external magnetic field to a magnetized layer (3) such that magnetization processes around external magnetic field. The external magnetic field is maintained until precision suffices to effect magnetization reversal. Independent claims are also included for the following: (a) magnetization reversal device;; (b) in plane magnetized method; (c) magnetic recording system.
Abstract:
The magnetization reversal method involves applying external magnetic field to a magnetized layer (3) such that magnetization processes around external magnetic field. The external magnetic field is maintained until precision suffices to effect magnetization reversal. Independent claims are also included for the following: (a) magnetization reversal device;; (b) in plane magnetized method; (c) magnetic recording system.
Abstract:
A scheme for ultrafast magnetization reversal in an in-plane magnetized laye r (3) is disclosed. For that, an external magnetic field Hex is applied such that the magnetization Mprecesses around the external magnetic field Hex and the external magnetic field Hex is maintained until the precession suffices to effect the magnetization reversal. The external magnetic field Hex is applied approximately perpendicular to the magnetization M.
Abstract:
PROBLEM TO BE SOLVED: To provide a storage system which enables memory density of several hundred Gb/inch2 without receiving mechanical wear. SOLUTION: The method of using a magnetizable memory medium (10), exposing the memory medium to an artificial external magnetic field H coupled externally to the memory medium, simultaneously applying heat extremely locally thereto at magnitude of a bit size in bit writing and making the external magnetic field locally greater than the holding magnetic field (dependent upon temperature) in locations (32) where the heat is applied is proposed. Further, two-dimensional arrays of cantilever chips (24) are advantageously used in this storage system. The respective chips act as heat sources when activated by current. The current flows in the resistance passages in the chips (24) and generates the necessary temperature in the small memory medium locations (32) where the writing of the bit is planned. This temperature is made closer to the Curie temperature or compensation temperature of the magnetic material.
Abstract:
PROBLEM TO BE SOLVED: To provide a deposition method for a non-volatile resistance switching memory. SOLUTION: The method for depositing a switching material can be switched between persistent conductive states. The microelectronic device is a non-volatile resistance switching memory comprising the switching material for storing digital information. The method comprises a step of depositing the switching material by a standard CMOS deposition technique at a temperature lower than 400°C. COPYRIGHT: (C)2006,JPO&NCIPI