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    Socket plate for a plug-in connection for two parts which are provided with plug pins
    1.
    发明专利
    Socket plate for a plug-in connection for two parts which are provided with plug pins 未知

    公开(公告)号：DE3310691A1

    公开(公告)日：1984-09-27

    申请号：DE3310691

    申请日：1983-03-24

    Applicant: IBM DEUTSCHLAND

    Inventor： STADLER EWALD ,  WAGNER OTTO DIPL ING ,  GRUBER HARALD ,  STAHL RAINER DIPL ING

    IPC: H01R12/71 ,  H01R23/72

    Abstract: The invention relates to a socket plate for a plug-in connection between a circuit board which is provided with plug pins and a printed circuit, and a circuit module which is provided with plug pins and has an upper and a lower covering plate and a plate which is located between them, is provided with resilient contacts in a sprung manner and is characterised in that it consists of an elastomeric material and has a matrix-like arrangement of continuous slots (7) which lie in rows and columns, in that the cover plates (9, 10) have an identical arrangement of outwardly inclined openings (2), and in that the side walls of the slots and the inclined surfaces of the openings have metallic contact strips (8) resting thereon, and in that this socket plate is held by means of an elastic frame which engages around the edges.

    MULTILAYER CERAMIC SUBSTRATE FOR SEMICONDUCTOR INTEGRATED CIRCUITS WITH A MULTILEVEL METALLIC STRUCTURE
    2.
    发明专利
    MULTILAYER CERAMIC SUBSTRATE FOR SEMICONDUCTOR INTEGRATED CIRCUITS WITH A MULTILEVEL METALLIC STRUCTURE 未知

    公开(公告)号：DE3172643D1

    公开(公告)日：1985-11-14

    申请号：DE3172643

    申请日：1981-12-23

    Applicant: IBM DEUTSCHLAND ,  IBM

    Inventor： SCHETTLER HELMUT DIPL ING ,  STADLER EWALD

    IPC: H01L23/12 ,  H01L23/538 ,  H01L23/58 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46 ,  H01L23/14 ,  H01L23/52 ,  H01L23/56

    Abstract: This invention concerns a ceramic substrate for mounting semiconductor integrated circuits. The substrates include at least a first and second patterned metallization layer which respectively form conducting planes that are parallel to each other but separated by a thickness of insulation. The pattern metallization of at least the first plane includes signal conductors for joining the contacts of the integrated circuit chip to pins provided in the substrate for connecting the substrate and chip to a circuit board. In accordance with the invention, the metallization of the second plane includes shorted conductor loops that follow the contour of the signal conductors. The shorted loops of the second plane metallization includes branches which extend parallel to both lateral sides of a respective signal conductor. In accordance with the invention, the branches of the loops are joined at their ends.

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