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公开(公告)号:DE3579621D1
公开(公告)日:1990-10-18
申请号:DE3579621
申请日:1985-04-19
Applicant: IMAI YOSHIO
Inventor: IMAI YOSHIO , SAWABE ATSUHITO , INUZUKA TADAO
Abstract: A process for preparing a diamond thin film by an electron assisted chemical vapor deposition (EACVD) is disclosed, in which diamond crystal nucleuses are caused to form and grow to a thin film on a plate substrate (24), maintained at a temperature of in excess of 400°C, under electron bombardments in an atmosphere of a mixed gas of a hydrogen and a hydrocarbon in a reduced pressure. A Boron doped p-type diamond semiconductor is prepared by an addition of a trace amount of diborane in the mixed gas of the hydrogen and the hydrocarbon in said EACVD.
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公开(公告)号:DE3639380C2
公开(公告)日:1999-05-27
申请号:DE3639380
申请日:1986-11-18
Applicant: MITSUBISHI CHEM CORP , IMAI YOSHIO , HINO TARO
Inventor: IMAI YOSHIO , HINO TARO , IWAMOTO MITSUMASA , KAKIMOTO MASAAKI , SUZUKI MASAAKI , KONISHI TORU
IPC: B01D69/12 , B01D71/64 , B05D1/20 , C01B3/50 , C08G73/10 , C08G73/14 , C08G73/16 , C08J5/18 , H01B3/30 , H01L21/312 , C08L79/08
Abstract: A film comprised of at least one monomolecular layer composed essentially of a polyimide having repeating units of the formula: wherein R1 is a tetravalent organic group and R2 is a bivalent organic group.
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公开(公告)号:DE3639380A1
公开(公告)日:1987-05-21
申请号:DE3639380
申请日:1986-11-18
Applicant: MITSUBISHI CHEM IND , IMAI YOSHIO , HINO TARO
Inventor: IMAI YOSHIO , HINO TARO , IWAMOTO MITSUMASA , KAKIMOTO MASAAKI , SUZUKI MASAAKI , KONISHI TORU
IPC: B01D69/12 , B01D71/64 , B05D1/20 , C01B3/50 , C08G73/10 , C08G73/14 , C08G73/16 , C08J5/18 , H01B3/30 , H01L21/312 , C08L79/08
Abstract: A film comprised of at least one monomolecular layer composed essentially of a polyimide having repeating units of the formula: wherein R1 is a tetravalent organic group and R2 is a bivalent organic group.
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公开(公告)号:DE3152516A1
公开(公告)日:1982-12-02
申请号:DE3152516
申请日:1981-11-18
Applicant: MASUHARA HIDEKAZU , IMAI YOSHIO , KADOMA YOSHINORI , UEDA MITSURU
Inventor: MASUHARA EIICHI , IMAI YOSHIO , KADOMA YOSHINORI , UEDA MITSURU
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公开(公告)号:JPH10132299A
公开(公告)日:1998-05-22
申请号:JP32749896
申请日:1996-11-01
Applicant: IMAI YOSHIO
Inventor: IMAI YOSHIO
Abstract: PROBLEM TO BE SOLVED: To facilitate cooking along with higher heat efficiency by placing a heat transfer body which is made of chips produced in machining of metal and formed in a flat or angular shape above a combustion flame of a cooking stove to evenly heat a heating surface. SOLUTION: A heat transfer body carrier plate 2 made up of a metal screen or the like is mounted above a combustion flame 1 of a cooking stove A and a heat transfer body 4b which is made of spiral chips 3 produced in machining of metal or produced by housing the chips 3 into a bag 5 made up of a metal screen and forming the work flat is mounted on the top surface of the carrier plate 2. A cooking device 6 such as pot, frying pan or steel plate for roasting is placed on the heat transfer body. The combustion flame 1 of the cooking stove A turns the whole of the heat transfer body to a heat source body 4b having a uniform heating value and enables evenly heating of a heating surface of the cooking device 6 hence facilitating cooking. This also accomplishes complete combustion of an incompletely burned gas by the stored heat of the heat transfer body thereby achieving a higher heat efficiency.
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公开(公告)号:JPH09217727A
公开(公告)日:1997-08-19
申请号:JP5992396
申请日:1996-02-09
Applicant: IMAI YOSHIO
Inventor: IMAI YOSHIO
Abstract: PROBLEM TO BE SOLVED: To attach/detach the suspended material of a hanging down type such as a plumb bob for surveying, curtain, and the like to/from hanger body simply and easily. SOLUTION: A hunger consists of a suspended material A which a part connected to a hanger body B is formed as a ball shaped connecting body, and the hanger body B which a hollow part 20 having a diameter larger than the diameter of the connecting body is arranged on the lower part inner center made of rubber of synthetic resin having a suitable elastic performance and strength, and a connecting body forcibly inserting hole 21 communicated to an outside is vertically arranged on the lower end of the hollow part 20. The connecting body is forcibly inserted and fitted in the hollow part 20 through the connecting body forcibly inserting hole 21 freely to insert and pull it.
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公开(公告)号:JPH06256259A
公开(公告)日:1994-09-13
申请号:JP3990793
申请日:1993-03-01
Applicant: IMAI YOSHIO , MITSUBISHI CHEM IND
Inventor: IMAI YOSHIO , KAKIMOTO MASAAKI , RYU TAKAO
Abstract: PURPOSE:To provide the novel compound useful as a raw material for aromatic polyamides used as a resin for coatings, films, fibers, molded products, etc. CONSTITUTION:A compound of formula I (Ar is group of formula II or formula III), e.g. 2,2'-di(p-carboxyphenoxy)biphenyl. The compound of formula I is obtained by thermally reacting 2,2'-biphenol with p-fluorobenzonitrile in a solvent (e.g. DMSO) and subsequently oxidizing the resultant 2,2'-di(p-cyanophenoxy) biphenyl in the presence of an alkali. The compound of formula I is polycondensed with an aromatic diamine into a polyamide of formula IV (Ar' is divalent aromatic organic residue), which is excellent in heat resistance and high in solubility in solvents.
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公开(公告)号:JPH06207024A
公开(公告)日:1994-07-26
申请号:JP33783092
申请日:1992-11-26
Applicant: CHISSO CORP , IMAI YOSHIO
Inventor: IMAI YOSHIO , KAKIMOTO MASAAKI , IYOKU YOSHITAKE
IPC: C08G73/10 , C08G77/42 , C08G77/455 , C08L79/08 , C08L83/04 , C09D179/08 , C09D183/04 , C09D183/10
Abstract: PURPOSE:To obtain a uniform, transparent and low-modulus polyamide-siloxane conjugate product excellent in combustibility by incorporating a specified alkoxysilane into an organic solvent containing a specified polyamic acid to effect hydrolysis and condensation, applying the obtained solution to a base plate, and baking it. CONSTITUTION:An organic solvent (e.g. N,N-dimethylacetamide) containing a polyamic acid having structural units of formula I [wherein R is a tetravalent organic group; R is CH3, C2H5 or phenyl; R is 1-8C alkyl; R is (trifluoro) methyl or trimethylsilyl; m is 0 to 3; m is 0 to 4; and n is 0 to 2] is mixed with at least one alkoxysilane of formula II (wherein p is 1 or 2) to effect hydrolysis and condenstion. The obtained solution is applied to a base plate (e.g. glass plate) and baked.
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公开(公告)号:JPH05105754A
公开(公告)日:1993-04-27
申请号:JP22008091
申请日:1991-08-30
Applicant: IMAI YOSHIO , MITSUBISHI CHEM IND
Inventor: IMAI YOSHIO , KAKIMOTO MASAAKI , RYU TAKAO , MARUYAMA MASAKI , ISHIDA MINA
IPC: C08G69/32
Abstract: PURPOSE:To obtain an aromatic polyamide having excellent heat resistance, soluble in organic solvent and useful as a raw material for resin of coating agent, film, etc., by carrying out the polycondensation of a specific aromatic diamine and an aromatic dicarboxylic acid (derivative). CONSTITUTION:The objective polyamide composed of the constituent unit of formula II (Ar is bivalent aromatic organic group) and having an intrinsic viscosity of >=0.4dL/g is obtained by the polycondensation of (A) an aromatic diamine consisting of 2,2'-di(p-aminophenoxy)-biphenyl of formula I and (B) an aromatic dicarboxylic acid (derivative) such as terephthalic acid and 3- chloroisophthalic acid in (C) an organic polar solvent such as N,N- dimethylacetamide.
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公开(公告)号:JPH0559169A
公开(公告)日:1993-03-09
申请号:JP22007991
申请日:1991-08-30
Applicant: IMAI YOSHIO , MITSUBISHI CHEM IND
Inventor: IMAI YOSHIO , KAKIMOTO MASAAKI , NISHIMURA KOICHI , ISHIDA MINA , KUROSAKI JUICHI
IPC: C08G73/10
Abstract: PURPOSE:To obtain a new polyimide resin having a specific intrinsic viscosity in N-methylpyrrolidone or cons. sulfuric acid, soluble in various organic solvents, having a high glass transition temperature, comprising a specific constituent unit. CONSTITUTION:A diphenylnaphtylamide shown by formula I (Ny is naphthyl which may contain substituent group) is reacted with a tetracarboxylic acid dianhydride shown by formula II (R is tetrafunctional aromatic group) in an organic solvent such as N,N-dimethylacetamide at -20 to 50 deg.C for several minutes to several days to give a polyamic acid and the polyamic acid is heated at 200-350 deg.C to give the objective resin comprising a constituent unit shown by formula III (A'r is bifunctional diphenylnaphthylamine), having 0.1-5dl/g intrinsic viscosity in N-methylpyrrolidone or cons. sulfuric acid at 30 deg.C.
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