A method for manufacturing a fluid sensor device and a fluid sensor device

    公开(公告)号:US20200350200A1

    公开(公告)日:2020-11-05

    申请号:US16957090

    申请日:2018-12-19

    Applicant: IMEC VZW

    Abstract: According to an aspect of the present inventive concept there is provided a method for manufacturing a fluid sensor device comprising: bonding a silicon-on-insulator arrangement comprising a silicon wafer, a buried oxide, a silicon layer, and a first dielectric layer, to a CMOS arrangement comprising a metallization layer and a planarized dielectric layer, wherein the bonding is performed via the first dielectric layer and the planarized dielectric layer; forming a fin-FET arrangement in the silicon layer, wherein the fin-FET arrangement is configured to function as a fluid sensitive fin-FET arrangement; removing the buried oxide and the silicon wafer; forming a contact to the metallization layer and the fin-FET arrangement, wherein the contact comprises an interconnecting structure configured to interconnect the metallization layer and the fin-FET arrangement; forming a channel comprising an inlet and an outlet, wherein the channel is configured to allow a fluid comprising an analyte to contact the fin-FET arrangement.

    WAVEGUIDE FOR GUIDING AN ELECTRO-MAGNETIC WAVE, A PHOTONIC INTEGRATED CIRCUIT COMPONENT, A SENSOR AND AN ACTUATOR

    公开(公告)号:US20200174186A1

    公开(公告)日:2020-06-04

    申请号:US16703242

    申请日:2019-12-04

    Abstract: A waveguide for guiding an electro-magnetic wave comprises: a first waveguide part; and a second waveguide part; wherein the first waveguide part has a first width in a first direction (Y) perpendicular to the direction of propagation of the electro-magnetic wave and the second waveguide part has a second width in the first direction (Y), wherein the second width is larger than the first width; and wherein the first and the second waveguide parts are spaced apart by a gap in a second direction (Z) perpendicular to the first and second planes in which the waveguide parts are formed, wherein the gap has a size which is sufficiently small such that the first and second waveguide parts unitely form a single waveguide for guiding the electro-magnetic wave.A photonic integrated circuit component, a sensor and an actuator comprising the waveguide are disclosed.

    SENSOR COMPRISING A WAVEGUIDE
    4.
    发明申请

    公开(公告)号:US20200173843A1

    公开(公告)日:2020-06-04

    申请号:US16703657

    申请日:2019-12-04

    Abstract: A sensor comprises: a thin structure, which is configured to receive a force for deforming a shape of the thin structure and which is arranged above a substrate; and a waveguide for guiding an electro-magnetic wave comprising: a first waveguide part; and a second waveguide part; wherein the second waveguide part has a larger width than the first waveguide part; and wherein the first and the second waveguide parts are spaced apart by a gap which is sufficiently small such that the first and second waveguide parts unitely form a single waveguide, wherein one of the first and the second waveguide part is arranged at least partly on the thin structure and another of the first and the second waveguide part is arranged on the substrate.

    METHOD FOR MANUFACTURING A WAVEGUIDE FOR GUIDING AN ELECTRO-MAGNETIC WAVE

    公开(公告)号:US20200174192A1

    公开(公告)日:2020-06-04

    申请号:US16703650

    申请日:2019-12-04

    Abstract: A method for manufacturing of a waveguide for guiding an electro-magnetic wave comprising: forming a first waveguide layer, a sacrificial layer and a protection layer on a first wafer, patterning to define a pattern of a first waveguide part and a supporting structure in the first waveguide layer; exposing the sacrificial layer on the first waveguide part while the protection layer still covers the sacrificial layer on the supporting structure; removing the sacrificial layer on the first waveguide part; removing the protection layer; bonding a second wafer to the sacrificial layer of the first wafer such that a second waveguide part is supported by the supporting structure and a gap corresponding to the thickness of the sacrificial layer is formed between the first and second waveguide parts.

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