公开(公告)号：US20180242449A1

公开(公告)日：2018-08-23

申请号：US15898986

申请日：2018-02-19

Applicant: IMEC VZW

Inventor： Riet LABIE ,  Frederic DUFLOS

IPC: H05K1/03 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/038 ,  H01R12/62 ,  H01R43/205 ,  H05K1/115 ,  H05K1/141 ,  H05K3/0058 ,  H05K3/301 ,  H05K3/325 ,  H05K3/4046 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0305 ,  H05K2201/10287 ,  H05K2201/10295

Abstract: According to an aspect of the present inventive concept there is provided a system comprising: a conductive textile including conductive fibers, an electronic circuit unit arranged on a first main surface of the conductive textile and including circuitry and a carrier supporting the circuitry, the carrier having a first main surface and a second main surface facing the first main surface of the textile and including a through-hole extending from the first main surface to the second main surface, a conductive pin including an leg segment arranged at least partly in the through-hole, and a grip segment arranged to grip about at least one fiber of the conductive textile. There is also provided a method for mounting an electronic circuit unit on a conductive textile.

公开(公告)号：US20240207845A1

公开(公告)日：2024-06-27

申请号：US18389977

申请日：2023-12-20

Applicant: IMEC VZW

Inventor： Lei ZHANG ,  Simone SEVERI ,  Riet LABIE ,  Philippe SOUSSAN ,  Tim STAKENBORG ,  Gauri KARVE

IPC: B01L3/00 ,  B81B7/00 ,  B81C1/00

CPC classification number: B01L3/502715 ,  B81B7/008 ,  B81C1/00238 ,  B01L2200/04 ,  B01L2300/0645 ,  B01L2300/168 ,  B81B2201/05 ,  B81B2203/0338 ,  B81B2207/07 ,  B81C2203/0792

Abstract: According to an aspect of the present inventive concept there is provided a microfluidic device comprising: at least one structure arranged in a pocket-defining layer defining a pocket in the pocket-defining layer; a semiconductor chip arranged in the pocket, the semiconductor chip comprising at least one electrode at the surface of the semiconductor chip; an electrical connection layer arranged above the semiconductor chip, wherein the electrical connection layer comprises electronic connections electrically connected to the at least one electrode and arranged to extend laterally in the electrical connection layer away from the semiconductor chip; at least one fluidic channel extending through the pocket-defining layer and above the semiconductor chip, the fluidic channel being arranged to be in fluidic communication with the at least one electrode.