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    LASER-BASED MATERIAL PROCESSING APPARATUS AND METHODS
    2.
    发明申请
    LASER-BASED MATERIAL PROCESSING APPARATUS AND METHODS 审中-公开
    基于激光的材料加工设备和方法

    公开(公告)号：WO2011123205A1

    公开(公告)日：2011-10-06

    申请号：PCT/US2011/026501

    申请日：2011-02-28

    Applicant: IMRA AMERICA, INC. ,  XU, Jingzhou ,  SOHN, Jin, Young ,  CHO, Gyu, Cheon ,  SHAH, Lawrence

    Inventor： XU, Jingzhou ,  SOHN, Jin, Young ,  CHO, Gyu, Cheon ,  SHAH, Lawrence

    IPC: B23K26/00

    CPC classification number: B23K26/00 ,  Y02P40/57

    Abstract: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse width sufficiently short so that material is efficiently removed by nonlinear optical absorption from the region and a quantity of heat affected zone and thermal stress on the material within the region, proximate to the region, or both is reduced relative to a quantity obtainable using a laser with longer pulses. In at least one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a composite material.

    Abstract translation: 各种实施例可以用于对工件的目标材料进行基于激光的修改，同时有利地实现处理生产量和/或质量的改善。 处理方法的实施例可以包括将激光脉冲聚焦并且以足够短的脉冲宽度将激光脉冲引导到工件的区域，使得通过来自该区域的非线性光学吸收和一定数量的热影响区和热应力有效地去除材料 区域内的材料，邻近区域或两者都相对于使用具有较长脉冲的激光可获得的量减少。 在至少一个实施例中，超短脉冲激光系统可以包括光纤放大器或光纤激光器中的至少一个。 各种实施例适合于在复合材料上或复合材料内的切割，切割，划线和成形特征中的至少一个。

    OPTICAL PULSE SOURCE WITH INCREASED PEAK POWER
    3.
    发明申请
    OPTICAL PULSE SOURCE WITH INCREASED PEAK POWER 审中-公开

    公开(公告)号：WO2012121920A3

    公开(公告)日：2012-09-13

    申请号：PCT/US2012/026748

    申请日：2012-02-27

    Applicant: IMRA AMERICA, INC. ,  XU, Jingzhou ,  CHO, Gyu Cheon

    Inventor： XU, Jingzhou ,  CHO, Gyu Cheon

    IPC: H01S3/10

    Abstract: In at least one embodiment time separated pulse pairs are generated, followed by amplification to increase the available peak and/or average power. The pulses are characterized by a time separation that exceeds the input pulse width and with distinct polarization states. The time and polarization discrimination allows easy extraction of the pulses after amplification. In some embodiments polarization maintaining (PM) fibers and/or amplifiers are utilized which provides a compact arrangement. At least one implementation provides for seeding of a solid state amplifier or large core fiber amplifier with time delayed, polarization split pulses, with capability for recombining the time separated pulses at an amplifier output. In various implementations suitable combinations of bulk optics and fibers may be utilized. In some implementations wavelength converted pulse trains are generated. A method and system of the present invention can be used in time domain applications utilizing multiple beam paths, for example spectroscopy.

    LASER-BASED MATERIAL PROCESSING METHODS AND SYSTEMS
    4.
    发明申请
    LASER-BASED MATERIAL PROCESSING METHODS AND SYSTEMS 审中-公开
    基于激光的材料加工方法与系统

    公开(公告)号：WO2009117451A1

    公开(公告)日：2009-09-24

    申请号：PCT/US2009/037443

    申请日：2009-03-17

    Applicant: IMRA AMERICA, INC. ,  SHAH, Lawrence ,  CHO, Gyu, Cheon ,  XU, Jingzhou

    Inventor： SHAH, Lawrence ,  CHO, Gyu, Cheon ,  XU, Jingzhou

    IPC: B23K26/06 ,  B23K26/38

    CPC classification number: H01L21/268 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/082 ,  B23K26/083 ,  B23K26/364 ,  B23K26/38 ,  B23K26/40 ,  B23K2201/40 ,  B23K2203/50

    Abstract: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate In at least one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may also include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond and/or picosecond pulses, and in some embodiments with pulse widths up to a few nanoseconds.

    Abstract translation: 各种实施例可以用于对工件的目标材料进行基于激光的修改，同时有利地实现处理生产量和/或质量的改善。 处理方法的实施例可以包括将激光脉冲聚焦并以足够高的脉冲重复频率将激光脉冲引导到工件的区域，使得材料有效地从该区域移除并且在该区域内靠近该区域的一些不想要的材料， 或者两者相对于以较低重复率可获得的量而减小。在至少一个实施例中，超短脉冲激光系统可以包括光纤放大器或光纤激光器中的至少一个。 各种实施例适合于在半导体衬底上或半导体衬底内的切割，切割，划线和形成特征中的至少一个。 工件材料还可以包括金属，无机或有机电介质，或用飞秒和/或皮秒脉冲微加工的任何材料，在一些实施例中，脉冲宽度可达几纳秒。

    MULTI-PULSE AMPLIFICATION
    5.
    发明申请
    MULTI-PULSE AMPLIFICATION 审中-公开

    公开(公告)号：WO2019023015A1

    公开(公告)日：2019-01-31

    申请号：PCT/US2018/042654

    申请日：2018-07-18

    Applicant: IMRA AMERICA, INC.

    Inventor： XU, Jingzhou ,  HORI, Takashi ,  SUZUKI, Shigeru ,  CHO, Gyu, Cheon

    IPC: H01S3/00 ,  H01S3/23

    Abstract: Chirped pulse amplification (CPA) systems configured to generate and amplify multi-pulses are described. The nonlinear interaction of pulses can generate a multiple pulse pack with a dense time separation between pulses. Reducing or eliminating the nonlinear interaction can be provided by spectrally and/or temporally splitting pulses in the chirped amplification system.

    METHODS AND SYSTEMS FOR LASER PROCESSING OF COATED SUBSTRATES
    6.
    发明申请
    METHODS AND SYSTEMS FOR LASER PROCESSING OF COATED SUBSTRATES 审中-公开
    涂层基体激光加工方法与系统

    公开(公告)号：WO2013106164A1

    公开(公告)日：2013-07-18

    申请号：PCT/US2012/069825

    申请日：2012-12-14

    Applicant: IMRA AMERICA, INC.

    Inventor： ARAI, Alan, Y. ,  CHO, Gyu, Cheon ,  XU, Jingzhou

    IPC: H01S3/30

    CPC classification number: H01L21/67092 ,  B23K26/0006 ,  B23K26/0057 ,  B23K26/40 ,  B23K2203/16 ,  B23K2203/172 ,  H01L21/2686 ,  H01L21/78 ,  H01L33/0095 ,  Y10S438/94

    Abstract: Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.

    Abstract translation: 公开了激光加工材料的方法和系统的实例。 用于单片化包括涂覆的基底的晶片的方法和系统可以利用激光输出具有对于晶片衬底是透明的但对涂层不透明的波长的光。 使用技术来管理激光束的注量和聚焦条件，涂层和基材可分别通过烧蚀和内部修饰进行处理。 内部修改可导致管芯分离。

    CONTROLLABLE MULTI-WAVELENGTH FIBER LASER SOURCE
    7.
    发明申请
    CONTROLLABLE MULTI-WAVELENGTH FIBER LASER SOURCE 审中-公开
    可控多波长光纤激光源

    公开(公告)号：WO2013039756A1

    公开(公告)日：2013-03-21

    申请号：PCT/US2012/053899

    申请日：2012-09-06

    Applicant: IMRA AMERICA, INC. ,  XU, Jingzhou ,  CHO, Gyu Cheon

    Inventor： XU, Jingzhou ,  CHO, Gyu Cheon

    IPC: G02B6/35 ,  G02B6/293

    CPC classification number: H01S3/06712 ,  G02B5/3083 ,  G02F1/353 ,  G02F1/3544 ,  G02F2001/3546 ,  H01S3/0092 ,  H01S3/067 ,  H01S3/06754 ,  H01S3/10053 ,  H01S3/10061

    Abstract: In at least one embodiment a laser system includes a fiber laser source, a polarization controller and a wavelength converter. The relative power distribution between a pump wavelength and a signal wavelength is controllable using the polarization controller. An optional phase compensator is used to control polarization state of the output laser beam. In various embodiments the relative power distribution among multiple wavelengths may be controlled over a range of at least about 100:1.

    Abstract translation: 在至少一个实施例中，激光系统包括光纤激光源，偏振控制器和波长转换器。 使用偏振控制器控制泵波长和信号波长之间的相对功率分布。 可选的相位补偿器用于控制输出激光束的偏振状态。 在各种实施例中，可以在至少约100:1的范围内控制多个波长之间的相对功率分布。

    PULSED LASER MICRO-DEPOSITION PATTERN FORMATION
    8.
    发明申请
    PULSED LASER MICRO-DEPOSITION PATTERN FORMATION 审中-公开
    脉冲激光微沉积图形成

    公开(公告)号：WO2010104651A1

    公开(公告)日：2010-09-16

    申请号：PCT/US2010/024344

    申请日：2010-02-17

    Applicant: IMRA AMERICA, INC. ,  LIU, Bing ,  HU, Zhendong ,  MURAKAMI, Makoto ,  XU, Jingzhou ,  CHE, Yong

    Inventor： LIU, Bing ,  HU, Zhendong ,  MURAKAMI, Makoto ,  XU, Jingzhou ,  CHE, Yong

    IPC: B23K26/00

    CPC classification number: C23C20/04 ,  B41M5/262 ,  B41M5/267 ,  B44F1/10 ,  C23C14/28 ,  C23C14/3435 ,  G02B26/101 ,  Y10T428/24802 ,  Y10T428/24917

    Abstract: A method of forming patterns on transparent substrates using a pulsed laser is disclosed. Various embodiments include an ultrashort pulsed laser, a substrate that is transparent to the laser wavelength, and a target plate. The laser beam is guided through the transparent substrate and focused on the target surface. The target material is ablated by the laser and is deposited on the opposite substrate surface. A pattern, for example a gray scale image, is formed by scanning the laser beam relative to the target. Variations of the laser beam scan speed and scan line density control the material deposition and change the optical properties of the deposited patterns, creating a visual effect of gray scale. In some embodiments patterns may be formed on a portion of a microelectronic device during a fabrication process. In some embodiments high repetition rate picoseconds and nanosecond sources are configured to produce the patterns.

    Abstract translation: 公开了使用脉冲激光在透明基板上形成图案的方法。 各种实施例包括超短脉冲激光器，对激光波长透明的衬底和靶板。 激光束被引导通过透明基板并聚焦在目标表面上。 目标材料被激光烧蚀并沉积在相对的基板表面上。 通过相对于目标扫描激光束来形成例如灰度图像的图案。 激光束扫描速度和扫描线密度的变化控制材料沉积并改变沉积图案的光学性质，产生灰度的视觉效果。 在一些实施例中，可以在制造过程期间在微电子器件的一部分上形成图案。 在一些实施例中，高重复率皮秒和纳秒源被配置为产生图案。

    TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER
    9.
    发明申请
    TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER 审中-公开

    公开(公告)号：WO2009114375A3

    公开(公告)日：2009-09-17

    申请号：PCT/US2009/036126

    申请日：2009-03-05

    Applicant: IMRA AMERICA, INC. ,  ARAI, Alan, Y. ,  CHO, Gyu, C. ,  XU, Jingzhou ,  YOSHINO, Fumiyo ,  ZHANG, Haibin ,  BOVATSEK, James

    Inventor： ARAI, Alan, Y. ,  CHO, Gyu, C. ,  XU, Jingzhou ,  YOSHINO, Fumiyo ,  ZHANG, Haibin ,  BOVATSEK, James

    IPC: B23K26/00

    Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

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