公开(公告)号：DE19853446C2

公开(公告)日：2002-08-08

申请号：DE19853446

申请日：1998-11-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOETHEL RALF

IPC: H01L21/68 ,  B65G49/07

公开(公告)号：DE10331012A1

公开(公告)日：2005-02-10

申请号：DE10331012

申请日：2003-07-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HINGST THOMAS ,  GOETHEL RALF

IPC: G01B11/26 ,  G03F9/00 ,  G01B11/24 ,  G01B11/00 ,  H01L21/66

Abstract: Method for measuring a geometric shape in or on a semiconductor wafer using an optical measurement system with a light source and an optical system has the following steps: recording an image of the geometric shape on the wafer; determination of a contrast value for the shape; comparison of the contrast value with a reference value; repetition of the imaging steps if the contrast value is less than the reference value and evaluation of the recorded image, whose contrast value corresponds at least to the reference contrast value or whose contrast value is the highest. An independent claim is made for an optical measurement system for measuring a geometric shape in or on a semiconductor wafer.

公开(公告)号：DE59807941D1

公开(公告)日：2003-05-22

申请号：DE59807941

申请日：1998-07-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KURTH KATHRIN ,  HORN MICHAEL ,  GEYER STEFAN ,  GOETHEL RALF

IPC: G01N1/28 ,  G01N1/00 ,  G01N21/88 ,  G01N21/93 ,  H01L21/304 ,  H01L21/66 ,  H01L23/544

Abstract: The calibration wafer (W) has adhered polymer balls (P) which are fixed via a heat treatment process. This is effected in a temperature at which the polymer balls start to soften. The heat treatment process for fixing the polymer balls may be effected within a temperature range between 80 and 95 degrees C.