1.
    发明专利
    未知

    公开(公告)号:DE59708003D1

    公开(公告)日:2002-09-26

    申请号:DE59708003

    申请日:1997-06-27

    Abstract: Production of an insulation layer, functioning as an inter-metal dielectric (IMD), involves: (a) covering a substrate surface (2) with a first insulating layer (3) and then a metal (preferably aluminium) layer; (b) photo-structuring the metal layer to form circuit lines (4) which are then covered with a second insulating layer (7) on their surfaces and side faces (6); (c) removing the second insulating layer material (7) from the first insulating layer regions (3) between the circuit lines (4); and (d) depositing a third insulating layer (8) on the resulting structure by ozone-activated CVD with a growth rate which is greater on the first insulating layer material (3) than on the second insulating layer material (7). Preferably, the first insulating layer material (3) is phosphosilicate glass, borophosphosilicate glass or undoped silicate glass and the second insulating layer material (7) is titanium nitride.

    2.
    发明专利
    未知

    公开(公告)号:AT222664T

    公开(公告)日:2002-09-15

    申请号:AT97110594

    申请日:1997-06-27

    Abstract: Production of an insulation layer, functioning as an inter-metal dielectric (IMD), involves: (a) covering a substrate surface (2) with a first insulating layer (3) and then a metal (preferably aluminium) layer; (b) photo-structuring the metal layer to form circuit lines (4) which are then covered with a second insulating layer (7) on their surfaces and side faces (6); (c) removing the second insulating layer material (7) from the first insulating layer regions (3) between the circuit lines (4); and (d) depositing a third insulating layer (8) on the resulting structure by ozone-activated CVD with a growth rate which is greater on the first insulating layer material (3) than on the second insulating layer material (7). Preferably, the first insulating layer material (3) is phosphosilicate glass, borophosphosilicate glass or undoped silicate glass and the second insulating layer material (7) is titanium nitride.

    3.
    发明专利
    未知

    公开(公告)号:DE59707295D1

    公开(公告)日:2002-06-20

    申请号:DE59707295

    申请日:1997-08-28

    Abstract: In a process for smoothening a substrate surface with level differences caused by metallic structures, a metallic layer made of a titanium compound is first applied on the surface and the side faces of the metallic structures before O3-activated separation of SiO2 or SiOF from a silicium precursor stage on the substrate surface provided with the metallic structures.

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