公开(公告)号：WO03026006A2

公开(公告)日：2003-03-27

申请号：PCT/DE0203147

申请日：2002-08-28

Applicant: INFINEON TECHNOLOGIES AG ,  GEYER KAI ,  GUNDLACH HARALD ,  SCHULTE-DOEINGHAUS BERNHARD

Inventor： GEYER KAI ,  GUNDLACH HARALD ,  SCHULTE-DOEINGHAUS BERNHARD

IPC: H01L23/31 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/3135 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/45099

Abstract: The invention relates to the arrangement of a semiconductor in a housing which comprises a Faraday shield-type screen surrounding the housing or suitable damping elements in the feed lines or both means can be used at the same time. In this manner, especially a chip card module housing can be provided with a screen. A semiconductor 1 is mounted on a chip support 2 and a sealing compound 3 is injection-molded around said semiconductor. The exterior of said sealing compound is provided with an electroconducting coating 4 which is linked with a metal layer 7 on the interior of the chip support.

Abstract translation: 该壳体具有围绕法拉第笼的方式屏蔽环，或者它们是在该处提供的电源线合适的阻尼元件，这两个装置可以被同时使用。 以这种方式，智能卡模块壳体可以设置有特别的屏蔽。 半导体芯片1安装在芯片载体2上，并用一块浇铸化合物3模制的，是一个导电涂层4施加在外侧并连接到金属层7上的芯片载体的内侧。

公开(公告)号：WO03017211A2

公开(公告)日：2003-02-27

申请号：PCT/DE0202757

申请日：2002-07-26

Applicant: INFINEON TECHNOLOGIES AG ,  GUNDLACH HARALD ,  MAYERHOFER BORIS ,  SPOETTL THOMAS

Inventor： GUNDLACH HARALD ,  MAYERHOFER BORIS ,  SPOETTL THOMAS

IPC: G06K9/00 ,  G07F7/10 ,  G06K9/20 ,  G07C9/00

CPC classification number: G06K19/0718 ,  G06K9/0002 ,  G06K19/07728

Abstract: The invention relates to a semiconductor chip (1) comprising a fingerprint sensor. Said chip is arranged in the card body (2) in such a position that when the chip card is bent, the load on the chip inside the entire arrangement of card and chip is minimised in such a way that sufficient security against fracture is achieved, at least in terms of the bending tests necessary for the ISO norm. To this end, a recess (3) is provided in the card body, in which the semiconductor chip is applied, preferably without a housing, in an adapted selected depth (d).

Abstract translation: 具有指纹传感器的半导体芯片（1）被放置在这样的位置，在卡体（2）内，该芯片的应力被最小化时，芯片卡的卡和芯片的整个阵列内的弯曲，从而有足够的耐破损性至少在 弯曲在按照ISO标准规定的测试得以实现。 为此目的，凹部（3）在卡体，其中，所述半导体芯片，而不需要单独壳体，在适当选择的深度（d）优选地附接提供。

公开(公告)号：DE50015958D1

公开(公告)日：2010-08-26

申请号：DE50015958

申请日：2000-05-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MUELLER JOCHEN ,  GUNDLACH HARALD

IPC: G06K19/077

公开(公告)号：AT333146T

公开(公告)日：2006-08-15

申请号：AT02011385

申请日：2002-05-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GUNDLACH HARALD ,  MARBACH-FISCHBACH IDA

IPC: G06K19/073 ,  H01L23/58 ,  H01L23/31

公开(公告)号：BR0115222A

公开(公告)日：2003-10-07

申请号：BR0115222

申请日：2001-11-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GUNDLACH HARALD ,  HOCHHOLZER MICHAEL ,  HOLWEG GERALD ,  KARGL WALTER ,  MUELLER-HIPPER ANDREAS ,  RIEDEL JENS

IPC: G06K19/07 ,  G06K19/077 ,  H01Q1/22 ,  H01Q5/10 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/30 ,  H04B5/02

Abstract: A contactless data storage medium has at least two antennas, in each case for different transmission bands. This makes it possible to configure a data storage medium such that it can be operated with read/write units that operate in accordance with different standards. At least two of the antennas form a unit, so that a configuration such as this can be produced at very low cost.

公开(公告)号：DE10145749A1

公开(公告)日：2003-04-24

申请号：DE10145749

申请日：2001-09-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SIMMERLEIN-ERLBACHER EWALD ,  MUELLER-HIPPER ANDREAS ,  GUNDLACH HARALD

IPC: H05K3/04 ,  H05K3/10 ,  H05K3/02

Abstract: Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be fixed on this bonding layer, or in which a metal foil or a metal layer is applied to the entire surface of a substrate body made from a plastics material and is pressed onto the substrate body with the aid of a structured, heated ram and fixed by a subsequent setting of the substrate body. The metal layer is structured by mechanical removal of those regions of the metal foil or of the metal powder which are not joined to the adhesive or to the substrate body.

公开(公告)号：DE10139383A1

公开(公告)日：2003-02-27

申请号：DE10139383

申请日：2001-08-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GUNDLACH HARALD

IPC: G06K19/077 ,  G06K19/08

Abstract: The invention relates to a chip module comprising a semiconductor chip (4) which is fixed to a main side of a flat expanded substrate (1). A second component (2) provided for receiving, outputting, reflecting or partially screening electromagnetic radiation, e.g. a radiation sensor or an optical display device, is applied to the same main side of the substrate and is connected to the semiconductor chip. The substrate must be permeable to a sufficient extent to the radiation in question, at least in a region (10) which is occupied by the second component.

公开(公告)号：DE10065540A1

公开(公告)日：2002-03-28

申请号：DE10065540

申请日：2000-12-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GUNDLACH HARALD ,  MUELLER-HIPPER ANDREAS ,  RADLIK WOLFGANG ,  SCHMID GUENTER

IPC: G06K19/077 ,  H05K1/09 ,  H05K1/16 ,  H05K3/00

Abstract: A strip conductor (4) is sprayed by a stencil mask or focussing spray device on the surface (3) of a plastic card body's (1) substrate in a gradually increasing thickness. For this purpose a suitable metal particle suspension is used that is a type of varnish made up of metal particles, a solvent and a polymer binder that causes the metal particle suspension to harden off after being sprayed on.

公开(公告)号：AT474285T

公开(公告)日：2010-07-15

申请号：AT00109645

申请日：2000-05-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MUELLER JOCHEN ,  GUNDLACH HARALD

IPC: G06K19/077

Abstract: Card body (1) has recess (2) to take up system component (5). System component does not have electrical connection to card body. Component contains chip module with external contacts, antenna coil, display, input unit, power source or converter, sensors, etc. which are electrically connected to each other by conductors (4) on base plate (6) to form system.

公开(公告)号：DE50205602D1

公开(公告)日：2006-04-06

申请号：DE50205602

申请日：2002-07-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GUNDLACH HARALD

IPC: G06K19/077

Abstract: The chip module comprises a semiconductor chip, which is fixed on a main side of a substrate of planar extent. A component, which is provided for taking up, emitting, reflecting or partially shielding electromagnetic radiation, e.g., a radiation sensor or an optical display device (display), is provided on the same main side of the substrate and is connected to the semiconductor chip. The substrate is transmissive to the relevant radiation to a sufficient extent and at least in a region occupied by the component.