公开(公告)号：WO2004020696A3

公开(公告)日：2005-01-20

申请号：PCT/DE0302560

申请日：2003-07-30

Applicant: INFINEON TECHNOLOGIES AG ,  KARL ANDREAS ,  MUELLER-HIPPER ANDREAS ,  SIMMERLEIN-ERLBACHER EWALD

Inventor： KARL ANDREAS ,  MUELLER-HIPPER ANDREAS ,  SIMMERLEIN-ERLBACHER EWALD

IPC: C23C18/16 ,  C23C18/20 ,  C25D3/00 ,  C25D5/56

CPC classification number: C23C18/2086 ,  C23C18/1644 ,  C23C18/1653 ,  C25D5/56 ,  Y10T428/12063

Abstract: The invention relates to a method for producing a foam metallic structure, said method comprising the following steps: a non-conductive substrate (10) having a foamed structure is prepared, conductive particles (16) are applied to said substrate in such a way that they are fixed to the entire surface (12) of the substrate, especially to each individual pore (11), and the pre-treated substrate (10) is inserted into a galvanising appliance (30) in which a homogeneous metallic layer (17) is formed on the conductive particles (16).

Abstract translation: 本发明涉及一种用于制造泡沫金属结构，其包括如下步骤：提供具有发泡结构的非导电性基板（10），所述基片上施加导电性粒子（16），使得这些基片的整个表面（12）上 特别是在每个单独的孔（11）是固定的，在其中的导电性粒子（16）的均匀的金属层（17）上形成有电镀（30）将所述预处理的衬底（10）。

公开(公告)号：DE10234705B4

公开(公告)日：2008-01-17

申请号：DE10234705

申请日：2002-07-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SIMMERLEIN-ERLBACHER EWALD ,  MUELLER-HIPPER ANDREAS ,  KARL ANDREAS

IPC: C25D17/00 ,  C25D5/18 ,  C25D7/06 ,  H05K1/00 ,  H05K3/24

Abstract: Electroplating device comprises an electrolyte bath (14) containing an anode unit (30) and contact units (16) each having a number of electrically conducting regions (20) of which at least one is connected to the anode or cathode. Preferred Features: Each electrically conducting region is connected as cathode or anode. The contact unit is cylindrical. The electrically conducting regions extend on the casing of the contact unit from a base surface in the direction of the other surface.

公开(公告)号：DE10145749A1

公开(公告)日：2003-04-24

申请号：DE10145749

申请日：2001-09-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SIMMERLEIN-ERLBACHER EWALD ,  MUELLER-HIPPER ANDREAS ,  GUNDLACH HARALD

IPC: H05K3/04 ,  H05K3/10 ,  H05K3/02

Abstract: Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be fixed on this bonding layer, or in which a metal foil or a metal layer is applied to the entire surface of a substrate body made from a plastics material and is pressed onto the substrate body with the aid of a structured, heated ram and fixed by a subsequent setting of the substrate body. The metal layer is structured by mechanical removal of those regions of the metal foil or of the metal powder which are not joined to the adhesive or to the substrate body.

公开(公告)号：DE10254927B4

公开(公告)日：2012-11-22

申请号：DE10254927

申请日：2002-11-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KARL ANDREAS ,  PUESCHNER FRANK ,  MUELLER-HIPPER ANDREAS ,  SIMMERLEIN-ERLBACHER EWALD

IPC: H05K3/10 ,  G06K19/077 ,  H01L21/768 ,  H05K3/18 ,  H05K3/24

Abstract: Verfahren zur Herstellung von leitfähigen Strukturen (15, 16) auf einem Kunststoffträger (10), bei dem zunächst eine Oberfläche (11) des Kunststoffträgers (10) mit einer Partikelschicht (13) versehen wird, anschließend eine Passivierungsschicht (14) auf die Partikelschicht (13) aufgebracht wird, wobei die Passivierungsschicht (14) als Negativbild der leitfähigen Struktur (15, 16) ausgebildet ist, und schließlich in den nicht durch die Passivierungsschicht (14) bedeckten Bereichen die leitfähige Struktur (15, 16) ausgebildet wird, dadurch gekennzeichnet, dass die Oberfläche (11) des Kunststoffträgers (10) unter Ausnutzung der Adhesivkraft unmittelbar nach einem Austritt des Kunststoffträgers (10) aus einem Kalander mit der durch leitfähige Partikel (12) gebildeten Partikelschicht (13) beschichtet wird, wobei die leitfähigen Partikeln (12) nicht miteinander leitend verbunden sind.

公开(公告)号：DE10238284B4

公开(公告)日：2004-11-18

申请号：DE10238284

申请日：2002-08-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SIMMERLEIN-ERLBACHER EWALD ,  KARL ANDREAS ,  MUELLER-HIPPER ANDREAS

IPC: C23C18/16 ,  C23C18/20 ,  C25D3/00 ,  C25D5/56 ,  C22C1/08 ,  B22F3/11

Abstract: A metal foam having a nonconductive substrate with a foamed structure which includes pores, the surface of the substrate being provided with conductive particles, and a homogenous metal layer being arranged on the conductive particles.

公开(公告)号：DE10254927A1

公开(公告)日：2004-06-17

申请号：DE10254927

申请日：2002-11-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KARL ANDREAS ,  PUESCHNER FRANK ,  MUELLER-HIPPER ANDREAS ,  SIMMERLEIN-ERLBACHER EWALD

IPC: H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H01L21/768

Abstract: A method of producing a conductive pattern on a substrate, including the steps of providing a surface of the substrate with a conductive layer, which is formed by providing the surface of the substrate at least partly with conductive particles, by directly using the adhesive power of the surface of the substrate, applying a passivation layer to the conductive layer, the passivation layer being formed as a negative image of the conductive pattern, and forming the conductive pattern in the regions not covered by the passivation layer.

公开(公告)号：DE10238284A1

公开(公告)日：2004-03-11

申请号：DE10238284

申请日：2002-08-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SIMMERLEIN-ERLBACHER EWALD ,  KARL ANDREAS ,  MUELLER-HIPPER ANDREAS

IPC: C23C18/16 ,  C23C18/20 ,  C25D3/00 ,  C25D5/56 ,  C22C1/08 ,  B22F3/11

Abstract: A metal foam having a nonconductive substrate with a foamed structure which includes pores, the surface of the substrate being provided with conductive particles, and a homogenous metal layer being arranged on the conductive particles.

公开(公告)号：DE10145750A1

公开(公告)日：2003-04-24

申请号：DE10145750

申请日：2001-09-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SIMMERLEIN-ERLBACHER EWALD ,  MUELLER-HIPPER ANDREAS ,  GUNDLACH HARALD

IPC: C23C2/02 ,  C23C18/16 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  C25D5/56 ,  C23C18/20 ,  B05D7/02

Abstract: Process for producing a metal layer on a substrate body. The process includes applying conductive particles to a surface of the substrate body, so that the conductive particles are fixed to the substrate body, and metallizing the substrate body together with the particles chemically and/or by electrodeposition in a metallization bath so as to form the metal layer.