公开(公告)号：DE10213879C1

公开(公告)日：2003-07-10

申请号：DE10213879

申请日：2002-03-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ADLER FRANK ,  HANISCH CHRISTIAN ,  MOSER MANFRED

IPC: H01L21/60 ,  H01L23/13 ,  H01L23/538 ,  H05K1/18 ,  H01L21/58 ,  H05K3/32

Abstract: The electronic component has an electronic circuit board (10) and at least one semiconductor chip (20) provided with an integrated circuit (21), fitting into a recess (15) provided in the surface of the electronic circuit board. The width and length of the recess corresponds to the size of the base surface of the semiconductor chip, with side elements for gripping the inserted semiconductor chip in the correct position for mechanical and electrical connection with the electronic circuit board.