1.
    发明专利
    未知

    公开(公告)号:DE102004060346B4

    公开(公告)日:2006-10-19

    申请号:DE102004060346

    申请日:2004-12-15

    Abstract: In a method for producing a semiconductor structure a semiconductor a substrate with a top surface is provided. A gate dielectric layer is provided on the top surface and on the gate dielectric layer is provided a memory cell array region with a first plurality of gate stacks and a peripheral element region with a second plurality of gate stacks. A dielectric layer is provided over the memory cell array region and the peripheral element region. A first source/drain implantation over the memory cell array region and the peripheral element region is carried out, a blocking mask over the memory cell array region is formed, the dielectric layer is removed using the blocking mask, and a second source/drain implantation over the memory cell array region and the peripheral element region is carried out, wherein the memory cell array region is protected by a mask.

    2.
    发明专利
    未知

    公开(公告)号:DE102004060346A1

    公开(公告)日:2006-07-20

    申请号:DE102004060346

    申请日:2004-12-15

    Abstract: In a method for producing a semiconductor structure a semiconductor a substrate with a top surface is provided. A gate dielectric layer is provided on the top surface and on the gate dielectric layer is provided a memory cell array region with a first plurality of gate stacks and a peripheral element region with a second plurality of gate stacks. A dielectric layer is provided over the memory cell array region and the peripheral element region. A first source/drain implantation over the memory cell array region and the peripheral element region is carried out, a blocking mask over the memory cell array region is formed, the dielectric layer is removed using the blocking mask, and a second source/drain implantation over the memory cell array region and the peripheral element region is carried out, wherein the memory cell array region is protected by a mask.

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