公开(公告)号：DE102006006570A1

公开(公告)日：2007-08-09

申请号：DE102006006570

申请日：2006-02-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WILLER JOSEF ,  IACONO STEPHANIE ,  MUELLER TORSTEN

IPC: H01L21/768

Abstract: A periodic pattern of conductor tracks with broader interspaces is produced by the application of a totally periodic pattern and subsequent removal of individual conductor tracks. An alternative method comprises the formation of a completely periodic hardmask, from which individual parts are removed. The modified hardmask is then used to etch a periodic pattern of conductor tracks with intermediate broader spaces.

公开(公告)号：DE102004015930A1

公开(公告)日：2005-11-03

申请号：DE102004015930

申请日：2004-03-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： JAHNKE ANDREAS ,  HENKE WOLFGANG ,  KUNKEL GERHARD ,  TEIPEL ANSGAR ,  IACONO STEPHANIE

IPC: G03F7/20

Abstract: The method involves applying a photoresist layer (10) on top of a semiconductor wafer (5). A projection apparatus is operated in two modes to project a circuit path pattern (14) onto the layer, where exposure light intensity is selected to be above an exposure threshold of the layer in one mode. The phase of the exposure light is controlled by an alternating phase shift mask (12). The layer is processed to form a resist pattern. An independent claim is also included for a use of a lithographic projection method for fabrication of an integrated circuit.