Abstract:
PROBLEM TO BE SOLVED: To provide a method for operation of an electrically writable and erasable memory cell where occurrence of an error is avoided properly. SOLUTION: In the method for operation of the memory cell, the memory cell has a channel area (2) in which operation is possible in a first direction and a second direction, and the memory cell is characterized by at least one effective parameter. Information is stored as a difference between a parameter operating in the channel area in the first direction and a parameter operating in the channel area in the second direction. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
A charge-trapping device includes a field effect transistor, which has source and drain regions. The source and drain regions have a dopant concentration profile, which has a gradient each in a vertical and a lateral direction with respect to a surface of a semiconductor substrate. The gradient in the lateral direction towards a depletion region of the transistor is larger than the gradient in the vertical direction towards a well region.
Abstract:
A semiconductor device comprises a transistor body of boron doped semiconductor substrate and a conterminous isolating area formed of insulating material, wherein an oxy-nitride layer is between the transistor body and the isolating area. This invention can be used in a transistor body for example in an NROM cell.
Abstract:
An oxidized region is arranged between a substrate of semiconductor material and a nitride liner, which covers wordline stacks of a memory cell array and intermediate areas of the substrate, and is provided to separate the nitride liner both from the substrate and from a memory layer sequence of dielectric materials that is provided for charge-trapping. The nitride liner is used as an etching stop layer in the formation of sidewall spacers used in a peripheral area to produce source/drain junctions of transistors of the addressing circuitry.
Abstract:
The semi conductor memory cell is of a read write type and has a canal region [2] that operates in a first and second direction. Information is stored based upon the difference in operating voltage in the canal region. The process is not affected by cross coupling between memory cells.
Abstract:
The surfaces of wordline stacks and intermediate areas of a main substrate surface are covered with an oxynitride liner. Either sidewall spacers of BPSG are formed or a further liner of nitride is deposited and spacers of oxide are formed. These spacers are used in a peripheral area of addressing circuitry to implant doped source/drain regions. The oxynitride reduces the stress between the nitride and the semiconductor material and prevents charge carriers from penetrating out of a memory layer of nitride into the liner.
Abstract:
Isolation trench arrangement, which isolates adjacent semiconductor structures ( 1 ), ( 2 ), an isolation trench ( 3 ) being formed in such a way that it penetrates from a substrate surface into the substrate volume ( 0 ) and has at least one insulating substance ( 20 ) and at least one conductive substance ( 21 ), and the conductive substance ( 21 ) is electrically conductively connected to the substrate ( 0 ) via an electrically conductive connection ( 22 ).
Abstract:
The semi conductor memory cell is of a read write type and has a canal region [2] that operates in a first and second direction. Information is stored based upon the difference in operating voltage in the canal region. The process is not affected by cross coupling between memory cells.