Abstract:
The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effects into account. A semiconductor memory test mode configuration includes a first capacitor for storing digital data. The first capacitor connects a cell plate line to a first bit line through a first select transistor. The first select transistor is activated through a connection to a word line. A second capacitor for storing digital data connects the cell plate line to a second bit line through a second select transistor. The second select transistor is also activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines for measuring a differential read signal on the first and second bit lines. A constant current mover, for example a constant current sink or source, is connected to the first bit line through a third transistor for changing the amount of charge on the first bit line when the third transistor is turned on to reduce the differential read signal.
Abstract:
The present invention provides at test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effects into account. A semiconductor memory test mode configuration includes a first capacitor for storing digital data and connecting a cell plate line to a first bit line through a first select transistor. The first select transistor activated through a connection to a word line. A second capacitor stores digital data and connects the cell plate line to a second bit line through a second select transistor. The second select transistor is activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines and measures a differential read signal on the first and second bit lines. A third transistor transfers charge between the first and second bit lines third to reduce the differential read signal.
Abstract:
The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effect into account. A semiconductor memory test mode configuration includes a first capacitor for storing digital data. The capacitor connects a cell plate line to a first bit line through a first select transistor. The first select transistor is activated through a connection to a word line. A second capacitor stores digital data and connects the cell plate line to a second bit line through a second select transistor. The second select transistor is also activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines and measures a differential read signal on the first and second bit lines. A potential is connected to the first bit line through a third transistor and changes a pre-charge signal level on the first bit line when the third transistor is turned on to reduce the differential read signal.
Abstract:
A test circuit for testing differential read signals during a memory access is disclosed. The test circuit is coupled to a pair of bitlines. During a read access, a selected memory cell produces a differential read signal on the bitlines. When the test circuit is activated, the magnitude of the differential read signal is varied. This enables easy testing of read signal margins in, for example, memory ICs.
Abstract:
A redundancy unit (204) comprising first (260) and second (270) fuse blocks for programming the redundancy element (220) is disclosed. One fuse block has laser blowable fuses and the other electrical fuses. The redundancy unit can be programmed by either one of the fuse blocks, enabling the redundancy unit to able to be used for defects identified before and after packaging.
Abstract:
A method is provided for fabricating a first and second MOSFET transistors in different electrically isolated active areas of a semiconductor body, each one of the transistors having a plurality of layers. A first gate oxide layer and a first poly-crystalline silicon layer are deposited over the semiconductor body over the active areas. Trenches are etched in said first gate oxide and poly-crystalline silicon layers and said semiconductor body to delineate the first and second active areas, thereby forming first delineated gate oxide layer and poly-crystalline silicon layers coextensive with the first active area. Material is deposited in said trenches to form the active area isolations, the active area isolations having a top surface above said semiconductor body. A masking layer is then formed over said first and second active areas and selective portions of it are removed to expose said second active area. The masking layer and the active area isolations together form a mask defining an opening coextensive with the second active area with the active area isolations defining said opening. Material through the opening to form a second gate oxide layer and a second poly-crystalline layer, such second layer and second poly-crystalline layer being coextensive with the second active area. The first transistor with the first delineated gate oxide and poly-crystalline layer as a pair of the plurality of layers of the first transistor and the second transistor with the second gate oxide layer and second poly-crystalline layer as a pair of the plurality of layers of the second transistor.
Abstract:
A chained memory IC in which a dual voltage scheme is used for operating the wordlines is described. During standby mode, the wordlines are maintained at a first logic 1 voltage level. To prepare for a memory access, the non-selected wordlines are driven to a boosted voltage while the selected wordline is driven to ground. The first logic 1 voltage level is less than the boosted voltage. This reduces the stress on the gate oxide of the transistors, thus improving reliability of the memory IC.
Abstract:
The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effects into account. A semiconductor memory test mode configuration includes a first capacitor for storing digital data The capacitor connects a cell plate line to a first bit line through a first select transistor. The first select transistor is activated through a connection to a word line. A second capacitor stores digital data and connects the cell plate line to a second bit line through a second select transistor. The second select transistor is also activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines and measures a differential read signal on the first and second bit lines. A potential is connected to the first bit line through a third transistor and changes a pre-charge signal level on the first bit line when the third transistor is turned on to reduce the differential read signal.
Abstract:
Improved sensing of ferroelectric memory cells is disclosed. When a memory access is initiated, the bitlines are precharged to a negative voltage, for example, -0.5 to -1.0V. This increases the effective plateline pulse (V PLH ) to V PLH +the magnitude of the negative voltage. This results in an increase in the difference between V HI and V L0 read signals, thereby increasing the sensing window.