公开(公告)号：JP2004202684A

公开(公告)日：2004-07-22

申请号：JP2003424295

申请日：2003-12-22

Applicant: Infineon Technologies Ag ,  インフィネオン テクノロジーズ アクチエンゲゼルシャフト

Inventor： KROENINGER WERNER ,  LANG GUENTER

IPC: H01L21/324 ,  B23Q3/08 ,  B24B37/30 ,  H01L21/304 ,  H01L21/673 ,  H01L21/683 ,  B24B41/06 ,  B24B37/04 ,  H01L21/68

CPC classification number: B24B37/30 ,  B23Q3/084 ,  B23Q3/086 ,  B23Q3/088 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S438/977 ,  Y10T156/1111 ,  Y10T156/1116 ,  Y10T156/1978 ,  Y10T428/249982

Abstract: PROBLEM TO BE SOLVED: To provide a simple method for processing a workpiece remarkable in points that a solid material is uniformly formed, and the workpiece and a workpiece carrier are easily separated, and also to provide the workpiece carrier particularly used for this method. SOLUTION: A description is particularly made on a method for fixing the processing workpiece 52 to the workpiece carrier 10 by using the solid material 62. This workpiece carrier 10 is composed of a porous substance (for example, porous ceramics). A wafer is easily used in processing by this processing method. This workpiece 52 is also easily separated by using a solvent of the workpiece carrier 10. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：DE10260233A1

公开(公告)日：2004-07-01

申请号：DE10260233

申请日：2002-12-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROENINGER WERNER ,  LANG GUENTER

IPC: H01L21/324 ,  B23Q3/08 ,  B24B37/30 ,  H01L21/304 ,  H01L21/673 ,  H01L21/683 ,  B25B11/00 ,  B23Q3/06

Abstract: The method involves using a solid material (62) to attach the workpiece (52) to a workpiece holder (10). The workpiece holder contains a porous material, or is made of a porous material. Preferably, a gas-permeable workpiece holder is used, and a vacuum is produced at the holder, after applying the solid material in liquefied form and/or prior to hardening the solid material. The porous material is a glass ceramic, a metal such as a sintered metal, a metal ceramic or a sintered material. The solid material is wax, adhesive, a plastics compound, or a double-sided adhesive tape. An Independent claim is included for a workpiece holder.

公开(公告)号：DE10054038A1

公开(公告)日：2002-05-16

申请号：DE10054038

申请日：2000-10-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HECHT FRANZ ,  LANG GUENTER ,  KROENINGER WERNER

IPC: C30B33/00 ,  H01L21/00 ,  H01L21/683 ,  B28D5/00 ,  H01L21/301

Abstract: A device comprises a first plate-like body (1) having an upper side (31) and a second plate-like body (2) having an upper side (32). The upper sides are joined and the upper side of the first body has a pattern made from recesses (3). The pattern represents the individual pieces to be produced, the pieces being surrounded by the recesses. The depth of the recesses corresponds to the depth of the individual pieces to be produced. An Independent claim is also included for a process for separating the plate-like bodies. Preferred Features: The first plate-like body is a multiple layered ceramic substrate and is a semiconductor wafer whose upper side carries integrated circuits. The individual pieces are chips to be thinly ground.

公开(公告)号：DE10006527A1

公开(公告)日：2001-08-23

申请号：DE10006527

申请日：2000-02-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HECHT FRANZ ,  LANG GUENTER ,  KROENINGER WERNER

IPC: G03F7/20 ,  G03F7/42

Abstract: The apparatus includes at least two chucks for holding each wafer in an exposure position. A positioning device alternately positions one of the chucks in the exposure position. The positioning device is a turntable on which at least two chucks are arranged. The chucks may be six-inch or eight-inch chucks. The exposure time can be adjusted. After the exposure time has elapsed, an obscuring device is moved automatically between an exposed wafer and the exposure device.

公开(公告)号：DE10054038B4

公开(公告)日：2006-11-30

申请号：DE10054038

申请日：2000-10-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HECHT FRANZ ,  LANG GUENTER ,  KROENINGER WERNER

IPC: B28D5/00 ,  C30B33/00 ,  H01L21/00 ,  H01L21/301 ,  H01L21/683

公开(公告)号：DE10234659A1

公开(公告)日：2004-02-12

申请号：DE10234659

申请日：2002-07-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROENINGER WERNER ,  LANG GUENTER

IPC: G06K19/077 ,  H01L21/60 ,  H01L23/485 ,  H01L23/50

Abstract: Connecting arrangement (100) comprises: (a) an integrated electronic component (50) with contact surfaces (52, 54, 56, 58, 60) electrically insulated from each other; (b) a switching circuit support (10) with counter contact surfaces facing the contact surfaces; and (c) electrically conducting connections (102, 104, 106, 108, 110) made from conducting adhesive or conducting lacquer between each contact surface and its counter contact surface. The intermediate chamber between each contact surface and its counter contact surface is free from a solder layer. An Independent claim is also included for a process for the production of the connecting arrangement.