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公开(公告)号：AT445029T
公开(公告)日：2009-10-15
申请号：AT01120376
申请日：2001-08-25
Applicant: INFINEON TECHNOLOGIES AG
Inventor： FOERSTER JUERGEN , HECHT FRANZ , MUSSGER WERNER , FRANK MANFRED , KUHR JOERG , RAUSCH NORBERT
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公开(公告)号：DE50115154D1
公开(公告)日：2009-11-19
申请号：DE50115154
申请日：2001-08-25
Applicant: INFINEON TECHNOLOGIES AG
Inventor： FOERSTER JUERGEN , HECHT FRANZ , MUSSGER WERNER , FRANK MANFRED , KUHR JOERG , RAUSCH NORBERT
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公开(公告)号：DE10054038A1
公开(公告)日：2002-05-16
申请号：DE10054038
申请日：2000-10-31
Applicant: INFINEON TECHNOLOGIES AG
Inventor： HECHT FRANZ , LANG GUENTER , KROENINGER WERNER
IPC: C30B33/00 , H01L21/00 , H01L21/683 , B28D5/00 , H01L21/301
Abstract: A device comprises a first plate-like body (1) having an upper side (31) and a second plate-like body (2) having an upper side (32). The upper sides are joined and the upper side of the first body has a pattern made from recesses (3). The pattern represents the individual pieces to be produced, the pieces being surrounded by the recesses. The depth of the recesses corresponds to the depth of the individual pieces to be produced. An Independent claim is also included for a process for separating the plate-like bodies. Preferred Features: The first plate-like body is a multiple layered ceramic substrate and is a semiconductor wafer whose upper side carries integrated circuits. The individual pieces are chips to be thinly ground.
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Patent Agency Ranking
公开(公告)号：DE10044419C1
公开(公告)日：2002-05-02
申请号：DE10044419
申请日：2000-09-08
Applicant: INFINEON TECHNOLOGIES AG
Inventor： FOERSTER JUERGEN , FRANK MANFRED , HECHT FRANZ , KUHR JOERG , MUSSGER WERNER , RAUSCH NORBERT
IPC: C23C14/50 , C23C14/56 , C23C16/458
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公开(公告)号：DE10048881A1
公开(公告)日：2002-03-07
申请号：DE10048881
申请日：2000-09-29
Applicant: INFINEON TECHNOLOGIES AG
Inventor： HECHT FRANZ , KROENINGER WERNER , LUTZKE MELANIE
IPC: H01L21/00 , H01L21/683 , H01L21/58 , H01L21/304 , H01L21/68
Abstract: A device for planar connection of two wafers (1,2) together, includes a vacuum chamber (3), a chuck (4), a vacuum chamber cover (18) and a vacuum retaining device (19) for a wafer (1) which is arranged on the vacuum chamber cover such that the product wafer is arranged surface-congruently over the carrier wafer (2) and before joining of the product wafer and the carrier wafer, a spacing (a) is provided between them, such that the spacing is arranged in the vacuum chamber (3).
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公开(公告)号：DE10006527A1
公开(公告)日：2001-08-23
申请号：DE10006527
申请日：2000-02-15
Applicant: INFINEON TECHNOLOGIES AG
Inventor： HECHT FRANZ , LANG GUENTER , KROENINGER WERNER
Abstract: The apparatus includes at least two chucks for holding each wafer in an exposure position. A positioning device alternately positions one of the chucks in the exposure position. The positioning device is a turntable on which at least two chucks are arranged. The chucks may be six-inch or eight-inch chucks. The exposure time can be adjusted. After the exposure time has elapsed, an obscuring device is moved automatically between an exposed wafer and the exposure device.
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公开(公告)号：DE10054038B4
公开(公告)日：2006-11-30
申请号：DE10054038
申请日：2000-10-31
Applicant: INFINEON TECHNOLOGIES AG
Inventor： HECHT FRANZ , LANG GUENTER , KROENINGER WERNER
IPC: B28D5/00 , C30B33/00 , H01L21/00 , H01L21/301 , H01L21/683
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公开(公告)号：DE10111759A1
公开(公告)日：2002-10-02
申请号：DE10111759
申请日：2001-03-12
Applicant: INFINEON TECHNOLOGIES AG
Inventor： HECHT FRANZ , KROENINGER WERNER , MARIANI FRANCO
IPC: H01L23/31 , H01L23/498 , H01L23/04 , H01L23/16 , H01L23/50
Abstract: A semiconductor microchip (1) has connection contacts (5) and contacts/strip conductors (6) that couple the connection contacts with external electrical connections (4) and have the sort if flexibility that facilitates distortion in the semiconductor microchip in relation to the external electrical connections. The semiconductor microchip is embedded in a card body (3) by means of a sealing/covering compound (2).
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