公开(公告)号：JP2004202684A

公开(公告)日：2004-07-22

申请号：JP2003424295

申请日：2003-12-22

Applicant: Infineon Technologies Ag ,  インフィネオン テクノロジーズ アクチエンゲゼルシャフト

Inventor： KROENINGER WERNER ,  LANG GUENTER

IPC: H01L21/324 ,  B23Q3/08 ,  B24B37/30 ,  H01L21/304 ,  H01L21/673 ,  H01L21/683 ,  B24B41/06 ,  B24B37/04 ,  H01L21/68

CPC classification number: B24B37/30 ,  B23Q3/084 ,  B23Q3/086 ,  B23Q3/088 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S438/977 ,  Y10T156/1111 ,  Y10T156/1116 ,  Y10T156/1978 ,  Y10T428/249982

Abstract: PROBLEM TO BE SOLVED: To provide a simple method for processing a workpiece remarkable in points that a solid material is uniformly formed, and the workpiece and a workpiece carrier are easily separated, and also to provide the workpiece carrier particularly used for this method. SOLUTION: A description is particularly made on a method for fixing the processing workpiece 52 to the workpiece carrier 10 by using the solid material 62. This workpiece carrier 10 is composed of a porous substance (for example, porous ceramics). A wafer is easily used in processing by this processing method. This workpiece 52 is also easily separated by using a solvent of the workpiece carrier 10. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：WO2005101459A2

公开(公告)日：2005-10-27

申请号：PCT/EP2005051493

申请日：2005-04-01

Applicant: INFINEON TECHNOLOGIES AG ,  BRADL STEPHAN ,  GROMMES WALTHER ,  KROENINGER WERNER ,  MELZL MICHAEL ,  SCHWAIGER JOSEF ,  STACHE THILO

Inventor： BRADL STEPHAN ,  GROMMES WALTHER ,  KROENINGER WERNER ,  MELZL MICHAEL ,  SCHWAIGER JOSEF ,  STACHE THILO

IPC: H01L21/68 ,  H01L21/00

CPC classification number: H01L21/6836 ,  H01L2221/68327 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/139 ,  Y10S414/141 ,  Y10S438/977 ,  Y10T29/49998

Abstract: Disclosed is, among other things, a method in which a workpiece (14) is fastened to a workpiece support (12) with the aid of connecting means (18, 20), the workpiece (14) and the workpiece support (12) being joined together using an annular connecting means (18, 20). The resulting compound is machined, whereupon the machined workpiece (14) is separated from the workpiece support (12), making it possible to create a particularly simple machining process.

Abstract translation: 通过连接装置（18，20），来描述，除其他外，一种方法，其中，固定在工件支承件（12）的工件（14），其中，所述工件（14），并通过一个环形连接装置在工件支架（12）（18 ，20）连接在一起。 将得到的复合物（10）进行处理。 然后，从工件支架（12）加工工件（14）断开。 其结果是一种特别简单的加工方法。

公开(公告)号：WO2005101459B1

公开(公告)日：2006-06-29

申请号：PCT/EP2005051493

申请日：2005-04-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRADL STEPHAN ,  GROMMES WALTHER ,  KROENINGER WERNER ,  MELZL MICHAEL ,  SCHWAIGER JOSEF ,  STACHE THILO

IPC: H01L21/68

CPC classification number: H01L21/6836 ,  H01L2221/68327 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/139 ,  Y10S414/141 ,  Y10S438/977 ,  Y10T29/49998

Abstract: Disclosed is, among other things, a method in which a workpiece (14) is fastened to a workpiece support (12) with the aid of connecting means (18, 20), the workpiece (14) and the workpiece support (12) being joined together using an annular connecting means (18, 20). The resulting compound is machined, whereupon the machined workpiece (14) is separated from the workpiece support (12), making it possible to create a particularly simple machining process.

Abstract translation: 通过连接装置（18，20），来描述，除其他外，一种方法，其中，固定在工件支承件（12）的工件（14），其中，所述工件（14），并通过一个环形连接装置在工件支架（12）（18 ，20）连接在一起。 将得到的复合物（10）进行处理。 然后，从工件支架（12）加工工件（14）断开。 其结果是一种特别简单的加工方法。

公开(公告)号：WO2004059393A2

公开(公告)日：2004-07-15

申请号：PCT/EP0314460

申请日：2003-12-18

Applicant: INFINEON TECHNOLOGIES AG ,  KROENINGER WERNER ,  SCHNEEGANS MANFRED

Inventor： KROENINGER WERNER ,  SCHNEEGANS MANFRED

IPC: G03F7/16 ,  G03F7/32 ,  G03F7/34

CPC classification number: G03F7/32 ,  G03F7/16 ,  G03F7/161 ,  G03F7/34

Abstract: The invention relates to a method wherein a resist layer (12) is applied to a base layer (24). The resist layer (12) is made of an adhesive material, the adhesive force thereof either reducing or increasing during radiation. Removal of residue of the resist layer (12) is made easier due to said method.

Abstract translation: 是，除其他外，一种方法，其中基材层（24）上，形成抗蚀剂层中所述（12）被施加。 抗蚀剂层（12）由粘合材料，其粘合力通过照射减少或增加的。 特别是，抗蚀剂层（12）的残基的释放是通过这种方法促进。

公开(公告)号：DE102008045747A1

公开(公告)日：2009-04-16

申请号：DE102008045747

申请日：2008-09-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHNEEGANS MANFRED ,  KROENINGER WERNER

IPC: H01L21/78 ,  H01L21/301 ,  H01L21/68

Abstract: A method of making an integrated circuit includes providing a semiconductor wafer having a first surface and a second surface opposite the first surface, at least one of the first surface and the second surface including a metallization layer deposited onto the surface. The method additionally includes forming a first trench in the semiconductor wafer extending from one of the first surface and the second surface toward an other of the first surface and the second surface. The method further includes sawing a second trench in the other surface until the second trench communicates with the first trench, thus singulating the integrated circuit from the semiconductor wafer.

公开(公告)号：DE112006003839T5

公开(公告)日：2009-02-26

申请号：DE112006003839

申请日：2006-04-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROENINGER WERNER ,  KOTEK MANFRED ,  KOLLER ADOLF ,  MOHAMED ABDUL RAHMAN

IPC: H01L21/68 ,  H01L21/78

Abstract: A method of fabricating a semiconductor chip includes the providing an adhesive layer on the outer area of the active surface of a device wafer and attaching a rigid body to the active surface by the adhesive layer. The device wafer is thinned by treating the passive surface of the device wafer. A first backing tape is connected to the passive surface of the device wafer. The outer portion of the rigid body is separated from the central portion of the rigid body and the outer portion of the device wafer is separated from the central portion of the device wafer. The central portion of the rigid body, the outer portion of the device wafer and the outer portion of the rigid body are removed from the first backing tape. The device wafer may be diced into semiconductor chips.

公开(公告)号：DE102006046789A1

公开(公告)日：2008-04-03

申请号：DE102006046789

申请日：2006-10-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROENINGER WERNER ,  MARIANI FRANCO

IPC: H01L23/485 ,  H01L21/58

Abstract: The component (10) has an integrated component (12) with thinned wafers such as semiconductor substrates e.g. single crystal semiconductor substrates. A layer region (14) is electrically conductively arranged at the wafers, where the layer thickness of the layer region is larger than 10 micrometers or larger than 50 micrometers. The wafers and the layer region have a same contour at a boundary layer between the wafers and the layer region. A housing body (26) is arranged to the wafers and the layer region. An independent claim is also included for a method for manufacturing an electronic component.

公开(公告)号：DE10131665B4

公开(公告)日：2005-09-22

申请号：DE10131665

申请日：2001-06-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROENINGER WERNER ,  MARIANI FRANCO

IPC: G01N21/95 ,  G01N21/88 ,  H01L21/66

公开(公告)号：DE19936322C2

公开(公告)日：2001-08-09

申请号：DE19936322

申请日：1999-08-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRANK MANFRED ,  KROENINGER WERNER ,  KOEPNICK RENATE ,  HUMMEL RICHARD ,  FISCHBACH REINHARD ,  OPOLKA HEINZ

IPC: G01B7/28 ,  A61B5/1172 ,  C10M107/38 ,  C10M107/50 ,  C10M173/00 ,  G06K9/00 ,  H01L23/29 ,  H01L23/31 ,  C09D191/00 ,  C09D183/04 ,  C09D127/18 ,  C10M169/00 ,  G01R27/26 ,  A61B5/117 ,  G06K9/28

Abstract: To increase the scratch resistance of a surface passivation, in particular, for fingerprint sensors, a antifrictional layer is applied to reduce the shearing forces. The antifrictional layer includes fat, oil, surfactants and/or wax. The antifrictional layer is preferably an emulsion including water, paraffin oil, propylene glycol, stearic acid, palmitic acid, TEA, beeswax, carbormer 954, methylparaben, propylparaben and possibly perfume.

公开(公告)号：DE102009015722B4

公开(公告)日：2020-07-09

申请号：DE102009015722

申请日：2009-03-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROENINGER WERNER ,  SCHWAIGER JOSEF ,  SCHNEIDER LUDWIG ,  GEITNER OTTMAR ,  BRUNNBAUER MARKUS ,  MEYER THORSTEN ,  OTREMBA RALF ,  HOEGLAUER JOSEF ,  STRACK HELMUT ,  SCHLOEGEL XAVER

IPC: H01L21/77 ,  H01L21/56 ,  H01L23/31

Abstract: Verfahren zum Herstellen eines Halbleiterbauelements, mit den folgenden Schritten:Platzieren von mindestens zwei Halbleiterchips (3) auf einem Träger (1);Überdecken der mindestens zwei Halbleiterchips (3) mit einem Vergussmaterial (7), um einen vergossenen Körper (70) zu bilden;Dünnen des vergossenen Körpers (70), wodurch eine erste Hauptoberfläche der mindestens zwei Halbleiterchips (3) freigelegt wird;Ausbilden je einer Kontaktstelle (9) auf der freigelegten Hauptoberfläche der mindestens zwei Halbleiterchips (3) nach dem Dünnen;Aufbringen einer ersten Schicht (13, 19) aus leitfähigem Material über der ersten Hauptoberfläche der mindestens zwei Halbleiterchips (3) nach dem Ausbilden je einer Kontaktstelle (9), wobei die erste Schicht (13, 19) aus leitfähigem Material elektrisch mit der Kontaktstelle (9) an jedem der mindestens zwei Halbleiterchips (3) verbunden ist;Entfernen des Trägers (1) von den mindestens zwei Halbleiterchips (3); undZertrennen des vergossenen Körpers (70) derart, dass die mindestens zwei Halbleiterchips (3) vereinzelt werden, wobei die Halbleiterchips (3) Leistungshalbleiterchips sind.