公开(公告)号：DE102005035387A1

公开(公告)日：2007-02-01

申请号：DE102005035387

申请日：2005-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LESEDUARTE SERGIO ,  LEGEN ANTON ,  WOOD STEVE

IPC: G06F1/20 ,  H01L23/40 ,  H05K7/20

Abstract: A cooling body or heat sink (4) includes a side surface (18) lying on one side of the module (2) and dispersing heat from the components, as a first element (19) of the cooling body. A further cooling element (27) takes up the heat from the side surface and generates an air flow (50). This component extends to the side surface when the module is inserted in the slot and the cooling body is installed on the module. Independent claims are also included for the following: (i) a computer system with the above cooling body; and (ii) a process of cooling.

公开(公告)号：DE102005035387B4

公开(公告)日：2007-07-05

申请号：DE102005035387

申请日：2005-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LESEDUARTE SERGIO ,  LEGEN ANTON ,  WOOD STEVE

IPC: G06F1/20 ,  H01L23/40 ,  H05K7/20