公开(公告)号：DE102006012446B3

公开(公告)日：2007-12-20

申请号：DE102006012446

申请日：2006-03-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LEGEN ANTON ,  NEUMAIER KLAUS ,  MORGENROTH LUTZ ,  WOOD STEVE

IPC: H01L25/10 ,  G06F1/20 ,  G11C5/04 ,  H01L23/36 ,  H05K7/20

Abstract: A memory module includes a cooling element with a board. The board includes a surface on which at least one first electronic component and at least one second electronic component are arranged, a cooling element that is arranged on the surface of the board and includes first and second sections extending in a first direction. At least one stabilizing element that extends in the first direction is arranged at first and second ends of the first section of the cooling element. A surface of the first section of the cooling element is at a first distance from the surface of the board and a surface of the second section of the cooling element is at a second distance from the surface of the board, the first distance being different from the second distance.

公开(公告)号：DE102005035387A1

公开(公告)日：2007-02-01

申请号：DE102005035387

申请日：2005-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LESEDUARTE SERGIO ,  LEGEN ANTON ,  WOOD STEVE

IPC: G06F1/20 ,  H01L23/40 ,  H05K7/20

Abstract: A cooling body or heat sink (4) includes a side surface (18) lying on one side of the module (2) and dispersing heat from the components, as a first element (19) of the cooling body. A further cooling element (27) takes up the heat from the side surface and generates an air flow (50). This component extends to the side surface when the module is inserted in the slot and the cooling body is installed on the module. Independent claims are also included for the following: (i) a computer system with the above cooling body; and (ii) a process of cooling.

公开(公告)号：DE102007052840B4

公开(公告)日：2015-10-22

申请号：DE102007052840

申请日：2007-11-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BRAUN GEORG ,  LUYKEN RICHARD JOHANNES ,  PRETE EDOARDO ,  SANDERS ANTHONY ,  SCHEIDELER DIRK ,  TROST HANS-PETER ,  WOOD STEVE

IPC: G11C5/14 ,  G06F1/32 ,  G11C11/4074

Abstract: Vorrichtung (100), die als eine Latch-Stufe in eine asynchrone Latch-Kette schaltbar ist, die folgende Merkmale aufweist: eine Empfangsschnittstelle (120, 180), wobei auf einen Empfang eines ersten Signals an der Empfangsschnittstelle hin die Vorrichtung abhängig von einem zweiten Signal an der Empfangsschnittstelle in einen ersten Leistungssparmodus oder einen zweiten Leistungssparmodus umschaltet; und wobei die Vorrichtung in dem ersten Leistungssparmodus einen ersten Leistungsverbrauch und eine erste Aufwachzeit und in dem zweiten Leistungssparmodus einen zweiten Leistungsverbrauch und eine zweite Aufwachzeit bietet, dadurch gekennzeichnet, dass das zweite Signal Informationen bezüglich einer Position der Vorrichtung (100) als eine Latch-Stufe in der asynchronen Latch-Kette und Informationen bezüglich der Länge der asynchronen Latch-Kette aufweist.

公开(公告)号：DE102005035387B4

公开(公告)日：2007-07-05

申请号：DE102005035387

申请日：2005-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LESEDUARTE SERGIO ,  LEGEN ANTON ,  WOOD STEVE

IPC: G06F1/20 ,  H01L23/40 ,  H05K7/20

公开(公告)号：DE102006002090A1

公开(公告)日：2007-07-26

申请号：DE102006002090

申请日：2006-01-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LEGEN ANTON ,  WOOD STEVE

IPC: H01L23/36 ,  G06F1/20 ,  G11C5/00 ,  H01L25/10

Abstract: Box has an even metal plate (100), at which the memory module is provided. The metal plate at the outer edge has a reinforcement element (110), which runs partially along the outer edge. The metal plate (100) has a central reinforcement element (120) located at a distance from the outer side (104). A thermally well conductive material, preferably a thermally well conductive elastomer and/or a (Thermal Interface Material) TIM material, is arranged between a metal plate (150) and the memory module. An independent claim is also included for the memory module radiator box mounting clip has a projection, pointing inwards in the assembly clip at a free end-section.