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公开(公告)号：DE102005035387A1
公开(公告)日：2007-02-01
申请号：DE102005035387
申请日：2005-07-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor： LESEDUARTE SERGIO , LEGEN ANTON , WOOD STEVE
Abstract: A cooling body or heat sink (4) includes a side surface (18) lying on one side of the module (2) and dispersing heat from the components, as a first element (19) of the cooling body. A further cooling element (27) takes up the heat from the side surface and generates an air flow (50). This component extends to the side surface when the module is inserted in the slot and the cooling body is installed on the module. Independent claims are also included for the following: (i) a computer system with the above cooling body; and (ii) a process of cooling.
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公开(公告)号：DE102005015036A1
公开(公告)日：2006-02-16
申请号：DE102005015036
申请日：2005-03-31
Applicant: INFINEON TECHNOLOGIES AG
Inventor： REISS MARTIN , GRAFE JUERGEN , LEGEN ANTON , CARMONA MANUEL
Abstract: An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.
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公开(公告)号：DE102004029586A1
公开(公告)日：2006-01-12
申请号：DE102004029586
申请日：2004-06-18
Applicant: INFINEON TECHNOLOGIES AG
Inventor： REISS MARTIN , LEGEN ANTON , CARMONA MANUEL , NOCKE KERSTIN
IPC: H01L23/04
Abstract: The invention, which relates to an electronic component with a semiconductor chip, which is connected to a carrier substrate and surrounded by a housing, is based on presenting a substrate-based, housed electronic component, which enables the continuous release of the internal vapor pressure arising when the electronic component is heated, and at the same time can be produced inexpensively using the known and tried-and-tested methods and materials. According to embodiments of the invention, this is achieved by virtue of the fact that the carrier substrate comprises a plurality of hollow vias open on both sides, which vias are distributed areally in at least one section of the carrier substrate that is covered by the housing.
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公开(公告)号：DE102006012446B3
公开(公告)日：2007-12-20
申请号：DE102006012446
申请日：2006-03-17
Applicant: INFINEON TECHNOLOGIES AG
Inventor： LEGEN ANTON , NEUMAIER KLAUS , MORGENROTH LUTZ , WOOD STEVE
Abstract: A memory module includes a cooling element with a board. The board includes a surface on which at least one first electronic component and at least one second electronic component are arranged, a cooling element that is arranged on the surface of the board and includes first and second sections extending in a first direction. At least one stabilizing element that extends in the first direction is arranged at first and second ends of the first section of the cooling element. A surface of the first section of the cooling element is at a first distance from the surface of the board and a surface of the second section of the cooling element is at a second distance from the surface of the board, the first distance being different from the second distance.
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公开(公告)号：DE102004003275B4
公开(公告)日：2007-04-19
申请号：DE102004003275
申请日：2004-01-21
Applicant: INFINEON TECHNOLOGIES AG
Inventor： LEGEN ANTON , THOMAS JOCHEN , WENNEMUTH INGO
IPC: H01L23/50 , H01L21/44 , H01L21/60 , H01L23/48 , H01L23/485 , H01L23/495 , H01L25/065 , H01R12/50
Abstract: A connecting element for electrically connecting a semiconductor chip and a superordinate circuit board includes an elastic metal strip that is bent forming two metal limbs with flattened limb ends, thus forming a base between the metal limbs which is suitable for contacting and providing electrical connectivity to a plurality of contact pads of a superordinate circuit board. At least one of the two limb ends is electrically connected to the contact areas of a semiconductor chip, while the other limb end is elastically supported on the top side of the semiconductor chip, thereby enabling the connecting element to be self supporting.
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Patent Agency Ranking
公开(公告)号：DE10259221B4
公开(公告)日：2007-01-25
申请号：DE10259221
申请日：2002-12-17
Applicant: INFINEON TECHNOLOGIES AG
Inventor： THOMAS JOCHEN , HETZEL WOLFGANG , LEGEN ANTON
IPC: H01L23/50 , H01L21/50 , H01L23/31 , H01L25/065
Abstract: An electronic component comprises a semiconductor chip stack (3,4) on a wiring substrate (11) having external contacts (12). Between the chips is a wiring layer (7) having a through opening (8) and contact regions (9,10). Connections are made through the opening and there is a plastic housing (18,19) for the component. An Independent claim is also included for a production process for the above.
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公开(公告)号：DE102004029587B4
公开(公告)日：2006-05-24
申请号：DE102004029587
申请日：2004-06-18
Applicant: INFINEON TECHNOLOGIES AG
Inventor： REIS MARTIN , LEGEN ANTON , KROEHNERT STEFFEN
IPC: H01L23/04
Abstract: A ball grid array package includes a substrate. A number of solder balls overlie the solder ball surface of the substrate. The solder balls are arranged within a ballout area. A chip is attached to the chip surface of the substrate by an adhesive layer. Contact pads of the chip are electrically connected to ones of the solder balls. The chip has an area that is smaller than the ballout area and the adhesive layer has an area that is at least as large as the ballout area such that each solder ball in the ballout area is located beneath the adhesive layer.
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公开(公告)号：DE102006002090A1
公开(公告)日：2007-07-26
申请号：DE102006002090
申请日：2006-01-17
Applicant: INFINEON TECHNOLOGIES AG
Inventor： LEGEN ANTON , WOOD STEVE
Abstract: Box has an even metal plate (100), at which the memory module is provided. The metal plate at the outer edge has a reinforcement element (110), which runs partially along the outer edge. The metal plate (100) has a central reinforcement element (120) located at a distance from the outer side (104). A thermally well conductive material, preferably a thermally well conductive elastomer and/or a (Thermal Interface Material) TIM material, is arranged between a metal plate (150) and the memory module. An independent claim is also included for the memory module radiator box mounting clip has a projection, pointing inwards in the assembly clip at a free end-section.
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公开(公告)号：DE102004029584A1
公开(公告)日：2006-01-12
申请号：DE102004029584
申请日：2004-06-18
Applicant: INFINEON TECHNOLOGIES AG
Inventor： REISS MARTIN , LEGEN ANTON , CARMONA MANUEL , BENDER CARSTEN
Abstract: An arrangement increases the reliability of substrate-based Ball-Grid-Array (BGA) packages, with a die (chip) that is mounted on a substrate and electrically connected to interconnects of the substrate and for which the substrate is provided with solder balls arranged in a predetermined grid. The arrangement is particularly simple to realize and effective for increasing the reliability of substrate-based Ball-Grid-Array packages. This is achieved by a laminate layer provided with openings for receiving the solder balls at the positions of ball pads being laminated on the side of the substrate that is provided with the interconnects.
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公开(公告)号：DE102005035387B4
公开(公告)日：2007-07-05
申请号：DE102005035387
申请日：2005-07-28
Applicant: INFINEON TECHNOLOGIES AG
Inventor： LESEDUARTE SERGIO , LEGEN ANTON , WOOD STEVE
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