公开(公告)号：DE10349477A1

公开(公告)日：2005-02-24

申请号：DE10349477

申请日：2003-10-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHIES KLAUS ,  MAHLER JOACHIM ,  BERGMANN ROBERT

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/488 ,  H01L23/495 ,  H01L23/48

Abstract: A semiconductor component comprises housing (2) and chip (3) with a large surface contact between contact metal (5) on the chip and external contacts (6). Many small chip electrodes (7) are shorted to the contact metal and a transition layer (9) has contact bumps (11) surrounded by electrically conductive adhesive (12) on the contact metal.