公开(公告)号：WO03030246A3

公开(公告)日：2003-09-18

申请号：PCT/DE0203506

申请日：2002-09-19

Applicant: INFINEON TECHNOLOGIES AG ,  BERGMANN ROBERT ,  HUEBNER HOLGER

Inventor： BERGMANN ROBERT ,  HUEBNER HOLGER

IPC: B23K1/00 ,  B23K1/005 ,  B23K1/008 ,  B23K1/012 ,  B23K3/08 ,  F24C7/00 ,  F26B19/00 ,  H01L21/00 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H05K3/34 ,  H05K13/04

CPC classification number: H01L24/80 ,  B23K1/0056 ,  B23K2201/40 ,  H01L24/26 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/00

Abstract: According to the invention, a chip (4), maintained on a chip support (13) by means of a mandrel (1) is heated by a radiation source (12) on the side opposite to the wafer (2) so as to melt an input soldering metal applied on one side opposite to the wafer. A cleaning device (5) comprising a plate (6) provided with a slot (7), a gas channel (8) and a gas evacuation port (14) located proximate to the slot and designed for a forming gas is placed parallel to the wafer. The chip is moved vertically relative to the wafer, compressed on the wafer through the slot and soldered by isothermal solidification.

Abstract translation: 保持的芯片支撑件（13）绕卡盘（1）的芯片中的一个（4）被加热侧远离（2）在这里具有辐射源的晶片的一个（12），从而使熔化的上面向晶片侧地块的一侧施加的 是。 甲清洗装置（5）配有一个板（6）具有一个窗口在窗口（14），用于合成气体（7），气体通道（8）和一出气口布置安装平行于晶片。 芯片垂直移动到晶圆上，通过窗口压到晶圆上并通过等温固化进行焊接。

公开(公告)号：WO0227789B1

公开(公告)日：2002-07-25

申请号：PCT/DE0103439

申请日：2001-09-10

Applicant: INFINEON TECHNOLOGIES AG ,  BERGMANN ROBERT ,  LARIK JOOST ,  OTREMBA RALF ,  SCHLOEGEL XAVER ,  SCHREDL JUERGEN

Inventor： BERGMANN ROBERT ,  LARIK JOOST ,  OTREMBA RALF ,  SCHLOEGEL XAVER ,  SCHREDL JUERGEN

IPC: H01L23/482 ,  H01L23/495

CPC classification number: H01L24/48 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/83825 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: The aim of the invention is to take up the smallest amount of space possible while effecting the thermomechanical release in tension at the junction between a circuit unit (2) and contact device (4) of a circuit (1), said junction being provided by means of the connecting device (10). To this end, the connecting device (10) is essentially provided as a prefabricated metallic or alloy region in the area of the circuit unit (2) and in the area of the contact device (4) while avoiding, to the greatest possible extent, the use of adhesive elements and solder elements.

Abstract translation: 为了占用在热机械浮雕尽可能少的空间用于电路单元（2）的与接触装置的连接（4）的电路布置（1）通过连接装置（10），根据建议的本发明，所述连接装置（10）基本上是金属的，并且预制 形式或合金区域中的电路单元（2）的区域中并且在所述接触装置（4），同时基本上避免粘附元件和焊料元件的区域中。

公开(公告)号：DE10232788B4

公开(公告)日：2010-01-14

申请号：DE10232788

申请日：2002-07-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BEER GOTTFRIED ,  BERGMANN ROBERT ,  HONG HENG WAN JENNY

IPC: H01L23/06 ,  H01L21/50 ,  H01L23/057 ,  H01L23/16 ,  H01L23/34 ,  H01L23/433 ,  H01L23/495 ,  H01L23/50

Abstract: The device has at least one semiconducting chip, flat conductors, a heat conducting block for a system carrier and a housing of a synthetic material, whereby the chip is mounted on the heat conducting block by its passive rear side. Inner flat conductor ends are arranged in the block region to overlap and the electronic component has an organoceramic insulation, adhesive and heat conducting coating between the ends and the block in the overlap region. The device has at least one semiconducting chip, flat conductors, a heat conducting block for a system carrier and a housing of a synthetic material, whereby the chip is mounted on the heat conducting block by its passive rear side. Inner flat conductor ends are arranged in the block region to overlap and the electronic component has an organoceramic insulation, adhesive and heat conducting coating (6) between the ends and the block in the overlap region. Independent claims are also included for the following: (a) a system carrier (b) a method of manufacturing a system carrier (c) and a method of manufacturing an inventive electronic component with semiconducting chip.

公开(公告)号：DE10039927B4

公开(公告)日：2006-04-27

申请号：DE10039927

申请日：2000-08-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BERGMANN ROBERT ,  WAN JENNY HONG HENG

IPC: H01L23/04 ,  H01L21/58 ,  H01L23/00 ,  H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H05K3/34

Abstract: A housing for an SMD component has a molded body (1) for accommodating the component (2) and a 'heat slug' (3) joined to the molded body for supplying and removing of thermal energy for melting the solder paste (4). The housing has flow devices which are specifically formed by chamfers/tapers (11) of the molded body and/or of the 'heat slug' (3).

公开(公告)号：DE10124141B4

公开(公告)日：2009-11-26

申请号：DE10124141

申请日：2001-05-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BERGMANN ROBERT ,  LARIK JOOST ,  OTREMBA RALF ,  SCHLOEGEL XAVER ,  SCHREDL JUERGEN

IPC: H01L23/047 ,  H01L23/482 ,  H01L23/495 ,  H01L23/50

公开(公告)号：DE10147789A1

公开(公告)日：2003-04-10

申请号：DE10147789

申请日：2001-09-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HUEBNER HOLGER ,  BERGMANN ROBERT

IPC: B23K1/00 ,  B23K1/005 ,  B23K1/008 ,  B23K1/012 ,  B23K3/08 ,  F24C7/00 ,  F26B19/00 ,  H01L21/00 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H05K3/34 ,  H05K13/04

Abstract: According to the invention, a chip (4), maintained on a chip support (13) by means of a mandrel (1) is heated by a radiation source (12) on the side opposite to the wafer (2) so as to melt an input soldering metal applied on one side opposite to the wafer. A cleaning device (5) comprising a plate (6) provided with a slot (7), a gas channel (8) and a gas evacuation port (14) located proximate to the slot and designed for a forming gas is placed parallel to the wafer. The chip is moved vertically relative to the wafer, compressed on the wafer through the slot and soldered by isothermal solidification.

公开(公告)号：DE10206818A1

公开(公告)日：2003-08-28

申请号：DE10206818

申请日：2002-02-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  BERGMANN ROBERT

IPC: C09J5/06 ,  C09J9/02 ,  H01L21/60 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  H01L23/482 ,  H01L23/34 ,  H01L21/58

Abstract: Electronic component comprises an electrically conducting adhesive layer (2) between the metallic surfaces (3) of components (4) of the electronic component (1). The metallic surfaces lie opposite each other and the adhesive (5) has agglomerates (6) of electrically conducting nano-particles (7) having electrically conducting paths (9) surrounding the nano-particles in the adhesive base composition. Electronic component comprises an electrically conducting adhesive layer (2) between the metallic surfaces (3) of components (4) of the electronic component (1). The metallic surfaces lie opposite each other and the adhesive (5) has agglomerates (6) of electrically conducting nano-particles (7) having electrically conducting paths (9) surrounding the nano-particles in the adhesive base composition. The opposite-lying surfaces are electrically connected via a number of agglomerates of electrically conducting nano-particles distributed in the adhesive layer. An Independent claim is also included for a process for the production of an electronic component.

公开(公告)号：DE10039927A1

公开(公告)日：2002-03-07

申请号：DE10039927

申请日：2000-08-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BERGMANN ROBERT ,  WAN JENNY HONG HENG

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/433 ,  H05K3/34 ,  H01L23/04 ,  H01L23/36 ,  H01L21/58

Abstract: A housing for an SMD component has a molded body (1) for accommodating the component (2) and a 'heat slug' (3) joined to the molded body for supplying and removing of thermal energy for melting the solder paste (4). The housing has flow devices which are specifically formed by chamfers/tapers (11) of the molded body and/or of the 'heat slug' (3).

公开(公告)号：DE10339462A1

公开(公告)日：2005-03-31

申请号：DE10339462

申请日：2003-08-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BERGMANN ROBERT ,  SCHLOEGEL XAVER ,  OTREMBA RALF ,  SCHREDL JUERGEN

IPC: B23K1/00 ,  H01L21/60 ,  B23K31/02

Abstract: Process for fixing rigid connecting loop or leg (200) having contact surface (210) to connecting surface of semiconductor chip (100) comprises: (i) fixing loop or leg to the connecting surface (110); (ii) applying diffusion solder (30) to contact surface of the loop or leg; (iii) applying contact surface to the solder on the chip connecting surface; and (iv) heating the contact surface and connecting surface (110) to fuse solder and cooling.

公开(公告)号：DE10139681A1

公开(公告)日：2003-03-06

申请号：DE10139681

申请日：2001-08-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BERGMANN ROBERT ,  SCHREDL JUERGEN ,  OTREMBA RALF ,  SCHLOEGEL XAVER

IPC: H01L23/13 ,  H01L23/367 ,  H01L23/492 ,  H01L23/12 ,  H01L23/34

Abstract: Electronic component comprises a plate-like support element (2) having a contact zone and a semiconductor body (4) applied on the contact zone of the support element. The support element has a structure having alternating protrusions (22) and recesses (21) in the region of the contact zone. An Independent claim is also included for a process for the production of the electronic component. Preferred Features: The support element has strip-like protrusions in the region of the contact zone. The protrusions are surrounded by ring-like recesses. The semiconductor body is connected to the support element by a connecting layer, preferably made from gold, a gold compound, silver, a silver compound, tin, a tin compound, copper or a copper compound.