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公开(公告)号：DE59803646D1
公开(公告)日：2002-05-08
申请号：DE59803646
申请日：1998-07-27
Applicant: INFINEON TECHNOLOGIES AG
Inventor： KERN THOMAS , SOMMER DIETHER
Abstract: A proper functioning of an integrated circuit is monitored by monitoring a supply voltage of the integrated circuit. Dips in the supply voltage are ascertained. A signaling of the dips in the supply voltage is only effected if the supply voltage falls below a given voltage for a given minimum duration. As a result, the reliability of the integrated circuit is increased.
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公开(公告)号：HK1005300A1
公开(公告)日：1998-12-31
申请号：HK98104392
申请日：1998-05-21
Applicant: INFINEON TECHNOLOGIES AG
Inventor： SAVIGNAC DOMINIQUE , SOMMER DIETHER , WEIDENHOEFER JUERGEN
IPC: G11C11/413 , G11C11/401 , G11C29/00 , G11C29/04 , G11C , G06F
Abstract: The column redundancy device for a memory has a memory blocks (BK1... N), with memory cells arranged in x rows and y columns, redundant memory cells, which are arranged in b rows and c columns, a column decoder (CDEC) with c redundant column decoders (RCD1 ... N), and d coding elements (CF1,1 ... CFP,4). Each column decoder (RCD1 ... 4) is assigned to one of the c redundant columns of each memory block (BK1 ... N). Each of the d coding elements (CF1,1 ... CFP,4) includes means of decoding addresses, and can thus be assigned to any memory block (BK1... N).
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公开(公告)号：DE102006007303A1
公开(公告)日：2007-08-30
申请号：DE102006007303
申请日：2006-02-16
Applicant: INFINEON TECHNOLOGIES AG
Inventor： DOBRITZ STEPHAN , SOMMER DIETHER , GRUNE HARALD
Abstract: The printed circuit board (1) has a grouting cover element (4), in which multiple chips (2), electrically connected with the printed circuit board, are embedded. The grouting cover element is formed with a single-piece or with a molded heat dissipating element. The heat dissipating element is a cooling fin (41) manufactured integrally with the grouting cover element.
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