公开(公告)号：DE102008052470A1

公开(公告)日：2009-05-20

申请号：DE102008052470

申请日：2008-10-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAMMER MARKUS ,  RUHL GUENTHER ,  STRASER ANDREAS ,  MELZL MICHAEL ,  GOELLNER REINHARD ,  GROTELOH DOERTHE

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/50

Abstract: An integrated circuit includes a substrate. A surface region of the substrate includes a contact pad region. A passivation layer stack includes at least one passivation layer. The passivation layer stack is formed over the surface region and adjacent to the contact pad region. An upper portion of the passivation layer stack is removed in, in a portion of the passivation layer stack proximate the contact pad region.