公开(公告)号：DE60034611D1

公开(公告)日：2007-06-14

申请号：DE60034611

申请日：2000-02-04

Applicant: IBM ,  INFINEON TECHNOLOGIES AG

Inventor： WEBER STEFAN J ,  IGGULDEN ROY ,  NARAYAN CHANDRASEKHAR ,  BRINTZINGER AXEL CHRISTOPH ,  HOINKIS MARK ,  VAN DEN BERG ROBERT

IPC: H01H85/00 ,  H01H69/02 ,  H01L23/525 ,  H01L21/82

Abstract: A fuse for semiconductor devices in accordance with the present invention includes a substrate having a conductive path disposed on a surface thereof, a dielectric layer disposed on the substrate and a vertical fuse disposed perpendicularly to the surface through the dielectric layer and connecting to the conductive path, the vertical fuse forming a cavity having a liner material disposed along vertical surfaces of the cavity, the vertical surfaces being melted to blow the fuse. Methods for fabrication of the vertical fuse are also included.

公开(公告)号：DE60014994T2

公开(公告)日：2006-02-09

申请号：DE60014994

申请日：2000-02-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LIN CHENTING ,  VAN DEN BERG ROBERT ,  PANDEY SUMIT

IPC: B24B37/04 ,  B24B57/02 ,  H01L21/302 ,  H01L21/304

Abstract: Improved CMP uniformity is achieved by providing improved control of the slurry distribution. Improved slurry distribution is achieved by, for example, the use of a slurry dispenser (42) that dispenses slurry (44) from a plurality of dispensing points. Providing a squeeze bar between the slurry dispenser (42) and wafer to redistribute the slurry (44) also improves the slurry distribution.

公开(公告)号：DE60014994D1

公开(公告)日：2004-11-25

申请号：DE60014994

申请日：2000-02-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LIN CHENTING ,  VAN DEN BERG ROBERT ,  PANDEY SUMIT

IPC: B24B37/04 ,  B24B57/02 ,  H01L21/302 ,  H01L21/304

Abstract: Improved CMP uniformity is achieved by providing improved control of the slurry distribution. Improved slurry distribution is achieved by, for example, the use of a slurry dispenser (42) that dispenses slurry (44) from a plurality of dispensing points. Providing a squeeze bar between the slurry dispenser (42) and wafer to redistribute the slurry (44) also improves the slurry distribution.